Inventor · disambiguated record
Shigenori Harada
Also filed as: HARADA SHIGENORI
59 granted patents·3 pending applications·75 citations·filing 1977–2024
97Inventor score
Top patents by PatentIndex Score
62 records- 0190US11289379B2Wafer processing methodDISCO CORP·Filed 2020·Granted Mar 29, 2022·2 cites·12 claims
- 0289US11348797B2Stacked wafer processing methodDISCO CORP·Filed 2020·Granted May 31, 2022·2 cites·8 claims
- 0389US4090796ADevice for fastening needle case to yoke in universal joint of trunnion typeKOYO SEIKO CO·Filed 1977·Granted May 23, 1978·33 cites·4 claims
- 0487US12097633B2Cutting methodDISCO CORP·Filed 2021·Granted Sep 24, 2024·1 cites·4 claims
- 0581US11024543B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 1, 2021·1 cites·13 claims
- 0680US10991624B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2020·Granted Apr 27, 2021·1 cites·14 claims
- 0780US10500696B2Method of detecting clogging of chuck table and processing apparatusDISCO CORP·Filed 2018·Granted Dec 10, 2019·1 cites·8 claims
- 0879US10847420B2Wafer processing methodDISCO CORP·Filed 2019·Granted Nov 24, 2020·2 cites·11 claims
- 0972US11037814B2Wafer processing method using a ring frame with a polyester sheet with no adhesive layerDISCO CORP·Filed 2019·Granted Jun 15, 2021·1 cites·13 claims
- 1072US10879122B2Wafer processing methodDISCO CORP·Filed 2019·Granted Dec 29, 2020·1 cites·12 claims
- 1171US11062948B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jul 13, 2021·1 cites·12 claims
- 1265US9448500B2Magnetic iron oxide particles, magnetic carrier for electrophotographic developers and process for producing the same, and two-component system developerHARADA SHIGENORI·Filed 2012·Granted Sep 20, 2016·1 cites·10 claims
- 1364US11325804B2Tape attaching methodDISCO CORP·Filed 2020·Granted May 10, 2022·0 cites·3 claims
- 1462US12354902B2Wafer processing methodDISCO CORP·Filed 2022·Granted Jul 8, 2025·0 cites·10 claims
- 1560US11545393B2Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jan 3, 2023·0 cites·8 claims
- 1660US2024266221A1Processing method of workpieceDISCO CORP·Filed 2024·Application pending·0 cites
- 1759US11935738B2Method of processing a waferOKAMURA TAKASHI·Filed 2022·Granted Mar 19, 2024·0 cites·2 claims
- 1859US2021346990A1Workpiece processing methodDISCO CORP·Filed 2021·Application pending·0 cites
- 1957US9921510B2Magnetic carrier for electrophotographic developer and process for producing the same, and two-component system developerTODA KOGYO CORP·Filed 2017·Granted Mar 20, 2018·0 cites·13 claims
- 2057US5478926AMonoclonal antibody against human IgESHIONOGI & CO·Filed 1993·Granted Dec 26, 1995·14 cites·1 claims
- 2152US2022184768A1Edge trimming methodDISCO CORP·Filed 2021·Application pending·0 cites
- 2251US12424494B2Processing method of waferDISCO CORP·Filed 2021·Granted Sep 23, 2025·0 cites·20 claims
- 2349US11610815B2Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Mar 21, 2023·0 cites·11 claims
- 2449US11594454B2Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 28, 2023·0 cites·11 claims
- 2549US11587833B2Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 2649US11587832B2Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 2749US11476161B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2020·Granted Oct 18, 2022·0 cites·13 claims
- 2849US11393721B2Wafer processing methodDISCO CORP·Filed 2020·Granted Jul 19, 2022·0 cites·12 claims
- 2949US11380588B2Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jul 5, 2022·0 cites·15 claims
- 3049US11322407B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted May 3, 2022·0 cites·12 claims
- 3148US11396109B2Processing apparatusDISCO CORP·Filed 2020·Granted Jul 26, 2022·0 cites·4 claims
- 3248US11380587B2Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jul 5, 2022·0 cites·15 claims
- 3348US11361997B2Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jun 14, 2022·0 cites·21 claims
- 3448US11322406B2Wafer processing methodDISCO CORP·Filed 2020·Granted May 3, 2022·0 cites·8 claims
- 3548US11270916B2Wafer processing methodDISCO CORP·Filed 2020·Granted Mar 8, 2022·0 cites·18 claims
- 3648US11049772B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 29, 2021·0 cites·13 claims
- 3747US11302578B2Wafer processing methodDISCO CORP·Filed 2020·Granted Apr 12, 2022·0 cites·9 claims
- 3847US11251082B2Wafer processing methodDISCO CORP·Filed 2020·Granted Feb 15, 2022·0 cites·8 claims
- 3947US11056334B2Wafer processing method using a ring frame and a polyester sheetDISCO CORP·Filed 2019·Granted Jul 6, 2021·0 cites·10 claims
- 4047US11049757B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 29, 2021·0 cites·13 claims
- 4147US11031234B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2019·Granted Jun 8, 2021·0 cites·15 claims
- 4247US11018058B2Wafer processing method for dividing a wafer along predefined division lines using polyester sheetDISCO CORP·Filed 2020·Granted May 25, 2021·0 cites·9 claims
- 4347US11011407B2Wafer processing method using a ring frame and a polyolefin sheetDISCO CORP·Filed 2019·Granted May 18, 2021·0 cites·11 claims
- 4447US11004744B2Wafer processing method for dividing a wafer along predefined division linesDISCO CORP·Filed 2020·Granted May 11, 2021·0 cites·10 claims
- 4547US10998232B2Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheetDISCO CORP·Filed 2020·Granted May 4, 2021·0 cites·9 claims
- 4647US10991587B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·14 claims
- 4747US10985067B2Wafer processing method using a laser beam dividing stepDISCO CORP·Filed 2020·Granted Apr 20, 2021·0 cites·18 claims
- 4847US10720355B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jul 21, 2020·0 cites·9 claims
- 4946US11127633B2Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheetDISCO CORP·Filed 2019·Granted Sep 21, 2021·0 cites·21 claims
- 5046US11069574B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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