Inventor · disambiguated record
Il-Seok Son
Also filed as: SON IL-SEOK
11 granted patents·1 pending application·40 citations·filing 2013–2024
86Inventor score
Files withINTEL CORP12
Top patents by PatentIndex Score
12 records- 0197US10797139B2Methods of forming backside self-aligned vias and structures formed therebyINTEL CORP·Filed 2019·Granted Oct 6, 2020·22 cites·20 claims
- 0293US11264493B2Wrap-around source/drain method of making contacts for backside metalsINTEL CORP·Filed 2015·Granted Mar 1, 2022·9 cites·12 claims
- 0392US10367070B2Methods of forming backside self-aligned vias and structures formed therebyINTEL CORP·Filed 2015·Granted Jul 30, 2019·8 cites·21 claims
- 0483US2024413237A1Wrap-around source/drain method of making contacts for backside metalsINTEL CORP·Filed 2024·Application pending·0 cites
- 0575US12100761B2Wrap-around source/drain method of making contacts for backside metalsINTEL CORP·Filed 2022·Granted Sep 24, 2024·0 cites·17 claims
- 0675US12100762B2Wrap-around source/drain method of making contacts for backside metalsINTEL CORP·Filed 2022·Granted Sep 24, 2024·0 cites·20 claims
- 0772US11594452B2Techniques for revealing a backside of an integrated circuit device, and associated configurationsINTEL CORP·Filed 2020·Granted Feb 28, 2023·0 cites·24 claims
- 0869US10490449B2Techniques for revealing a backside of an integrated circuit device, and associated configurationsINTEL CORP·Filed 2015·Granted Nov 26, 2019·1 cites·9 claims
- 0964US10896847B2Techniques for revealing a backside of an integrated circuit device, and associated configurationsINTEL CORP·Filed 2019·Granted Jan 19, 2021·0 cites·14 claims
- 1052US10236282B2Partial layer transfer system and methodINTEL CORP·Filed 2013·Granted Mar 19, 2019·0 cites·25 claims
- 1152US9721898B2Methods of forming under device interconnect structuresINTEL CORP·Filed 2016·Granted Aug 1, 2017·0 cites·20 claims
- 1252US9490201B2Methods of forming under device interconnect structuresINTEL CORP·Filed 2013·Granted Nov 8, 2016·0 cites·50 claims
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