Inventor · disambiguated record
Asao Morikawa
Also filed as: MORIKAWA ASAO
19 granted patents·217 citations·filing 1986–1994
95Inventor score
Files withNGK SPARK PLUG CO19
Top patents by PatentIndex Score
19 records- 0173US5635301AMultilayered glass substrateNGK SPARK PLUG CO·Filed 1994·Granted Jun 3, 1997·36 cites·5 claims
- 0260US4837408AHigh density multilayer wiring board and the manufacturing thereofNGK SPARK PLUG CO·Filed 1988·Granted Jun 6, 1989·18 cites·6 claims
- 0356US4871608AHigh-density wiring multilayered substrateNGK SPARK PLUG CO·Filed 1987·Granted Oct 3, 1989·16 cites·2 claims
- 0455US4943470ACeramic substrate for electrical devicesNGK SPARK PLUG CO·Filed 1989·Granted Jul 24, 1990·21 cites·14 claims
- 0555US4801067AMethod of connecting metal conductor to ceramic substrateNGK SPARK PLUG CO·Filed 1987·Granted Jan 31, 1989·21 cites·3 claims
- 0652US5120473AMetallizing composition for use with ceramicsNGK SPARK PLUG CO·Filed 1988·Granted Jun 9, 1992·11 cites·2 claims
- 0752US4963187AMetallizing paste for circuit board having low thermal expansion coefficientNGK SPARK PLUG CO·Filed 1988·Granted Oct 16, 1990·16 cites·33 claims
- 0850US4941582AHermetically sealed ceramic packageNGK SPARK PLUG CO·Filed 1989·Granted Jul 17, 1990·16 cites·10 claims
- 0947US5122930AHigh heat-conductive, thick film multi-layered circuit boardNGK SPARK PLUG CO·Filed 1990·Granted Jun 16, 1992·16 cites·39 claims
- 1045US4810528AProcess for producing multilayer circuit boardNGK SPARK PLUG CO·Filed 1986·Granted Mar 7, 1989·12 cites·16 claims
- 1143US5261950AComposition for metalizing ceramicsNGK SPARK PLUG CO·Filed 1992·Granted Nov 16, 1993·6 cites·24 claims
- 1238US5175130ALow-temperature baked substrateNGK SPARK PLUG CO·Filed 1989·Granted Dec 29, 1992·6 cites·9 claims
- 1336US5405562AProcess of making a coated substrate having closed porosityNGK SPARK PLUG CO·Filed 1994·Granted Apr 11, 1995·5 cites·4 claims
- 1434US5011530AMetallizing composition for use with ceramicsNGK SPARK PLUG CO·Filed 1988·Granted Apr 30, 1991·5 cites·2 claims
- 1532US5352482AProcess for making a high heat-conductive, thick film multi-layered circuit boardNGK SPARK PLUG CO·Filed 1993·Granted Oct 4, 1994·4 cites·6 claims
- 1632US5003131AConnection structure between ceramic body and outer terminalNGK SPARK PLUG CO·Filed 1989·Granted Mar 26, 1991·4 cites·7 claims
- 1731US5318744AProcess for producing ceramic sintered body having metallized via holeNGK SPARK PLUG CO·Filed 1992·Granted Jun 7, 1994·2 cites·2 claims
- 1830US5011734ACeramic substrateNGK SPARK PLUG CO·Filed 1988·Granted Apr 30, 1991·1 cites·5 claims
- 1930US5006167AMetallizing compositionNGK SPARK PLUG CO·Filed 1989·Granted Apr 9, 1991·1 cites·9 claims
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