Inventor · disambiguated record
Wen-Chun Huang
Also filed as: HUANG WEN C · HUANG WEN-CHUN
95 granted patents·7 pending applications·1,264 citations·filing 2005–2024
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD34TAIWAN SEMICONDUCTOR MFG31WANG HUNG-CHUN7CHENG YING CHOU5CHANG CHING-HSU2
Top patents by PatentIndex Score
102 records- 0198US9679100B2Environmental-surrounding-aware OPCTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 13, 2017·20 cites·20 claims
- 0298US9390217B2Methodology of optical proximity correction optimizationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 12, 2016·68 cites·20 claims
- 0397US8764995B2Extreme ultraviolet light (EUV) photomasks, and fabrication methods thereofCHANG CHING-HSU·Filed 2010·Granted Jul 1, 2014·305 cites·20 claims
- 0497US8631360B2Methodology of optical proximity correction optimizationWANG HUNG-CHUN·Filed 2012·Granted Jan 14, 2014·34 cites·19 claims
- 0597US8601407B2Geometric pattern data quality verification for maskless lithographyWANG HUNG-CHUN·Filed 2011·Granted Dec 3, 2013·31 cites·20 claims
- 0697US8507159B2Electron beam data storage system and method for high volume manufacturingWANG HUNG-CHUN·Filed 2011·Granted Aug 13, 2013·29 cites·16 claims
- 0797US8473877B2Striping methodology for maskless lithographyWANG HUNG-CHUN·Filed 2011·Granted Jun 25, 2013·26 cites·20 claims
- 0896US9529959B2System and method for pattern correction in e-beam lithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 27, 2016·27 cites·17 claims
- 0996US8954899B2Contour alignment systemTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 10, 2015·60 cites·20 claims
- 1096US8841049B2Electron beam data storage system and method for high volume manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 23, 2014·28 cites·20 claims
- 1196US8627241B2Pattern correction with location effectWANG HUNG-CHUN·Filed 2012·Granted Jan 7, 2014·45 cites·18 claims
- 1296US8468473B1Method for high volume e-beam lithographyWANG HUNG-CHUN·Filed 2012·Granted Jun 18, 2013·34 cites·20 claims
- 1396US8464186B2Providing electron beam proximity effect correction by simulating write operations of polygonal shapesWANG HUNG-CHUN·Filed 2011·Granted Jun 11, 2013·29 cites·20 claims
- 1495US9176373B2System and method for decomposition of a single photoresist mask pattern into 3 photoresist mask patternsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 3, 2015·11 cites·20 claims
- 1595US8943445B2Method of merging color sets of layoutTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·29 cites·20 claims
- 1695US8739080B1Mask error enhancement factor (MEEF) aware mask rule check (MRC)TAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 27, 2014·46 cites·20 claims
- 1794US8119310B1Mask-shift-aware RC extraction for double patterning designLU LEE-CHUNG·Filed 2010·Granted Feb 21, 2012·11 cites·20 claims
- 1893US9209048B2Two step molding grinding for packaging applicationsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 8, 2015·19 cites·20 claims
- 1993US8745550B2Fracture aware OPCCHENG NIAN-FUH·Filed 2012·Granted Jun 3, 2014·38 cites·15 claims
- 2093US8418111B2Method and apparatus for achieving multiple patterning technology compliant design layoutCHEN HUANG-YU·Filed 2010·Granted Apr 9, 2013·29 cites·28 claims
- 2193US8381139B2Method for metal correlated via split for double patterningTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Feb 19, 2013·12 cites·20 claims
- 2292US10691864B2Method of post optical proximity correction (OPC) printing verification by machine learningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 23, 2020·9 cites·12 claims
- 2392US8527916B1Dissection splitting with optical proximity correction to reduce corner roundingCHIANG CHIA-PING·Filed 2012·Granted Sep 3, 2013·38 cites·18 claims
- 2491US8751976B2Pattern recognition for integrated circuit designTSAI CHENG-LUNG·Filed 2012·Granted Jun 10, 2014·28 cites·18 claims
- 2591US8381153B2Dissection splitting with optical proximity correction and mask rule check enforcementTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·21 cites·20 claims
- 2690US9852908B2Methods for integrated circuit design and fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·4 cites·20 claims
- 2790US9023695B2Method of patterning features of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 5, 2015·11 cites·15 claims
- 2890US8631379B2Decomposing integrated circuit layoutCHEN PI-TSUNG·Filed 2010·Granted Jan 14, 2014·21 cites·14 claims
- 2990US8431291B2Intensity selective exposure photomaskLIU GEORGE·Filed 2011·Granted Apr 30, 2013·5 cites·16 claims
- 3090US8372742B2Method, system, and apparatus for adjusting local and global pattern density of an integrated circuit designTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 12, 2013·14 cites·18 claims
- 3190US7954072B2Model import for electronic design automationTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 31, 2011·20 cites·20 claims
- 3289US8683392B2Double patterning methodologyHSIEH KEN-HSIEN·Filed 2011·Granted Mar 25, 2014·11 cites·17 claims
- 3389US2024379358A1Methods for integrated circuit design and fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3488US9262578B2Method for integrated circuit manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 16, 2016·9 cites·20 claims
- 3588US8949749B2Layout design for electron-beam high volume manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 3, 2015·12 cites·22 claims
- 3688US8681326B2Method and apparatus for monitoring mask process impact on lithography performanceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 25, 2014·9 cites·17 claims
- 3787US12159092B2Method for coloring circuit layout and system for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 3887US9514266B2Method and system of determining colorability of a layoutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 6, 2016·9 cites·20 claims
- 3987US8850367B2Method of decomposable checking approach for mask alignment in multiple patterningTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 30, 2014·9 cites·20 claims
- 4087US8527918B2Target-based thermal design using dummy insertion for semiconductor devicesCHENG YING-CHOU·Filed 2011·Granted Sep 3, 2013·11 cites·20 claims
- 4186US11048161B2Optical proximity correction methodology using pattern classification for target placementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 29, 2021·2 cites·20 claims
- 4286US10324369B2Methods for generating a mandrel maskTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·4 cites·19 claims
- 4384US10817635B2Multiple patterning method for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 27, 2020·3 cites·20 claims
- 4484US9165095B2Target point generation for optical proximity correctionTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 20, 2015·4 cites·20 claims
- 4583US9390223B2Method of determining whether a layout is colorableTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 12, 2016·2 cites·20 claims
- 4683US8332797B2Parameterized dummy cell insertion for process enhancementCHENG YING-CHOU·Filed 2010·Granted Dec 11, 2012·8 cites·18 claims
- 4782US11308256B2Method of post optical proximity correction (OPC) printing verification by machine learningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·1 cites·20 claims
- 4882US9911606B2Mandrel spacer patterning in multi-pitch integrated circuit manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 6, 2018·3 cites·20 claims
- 4982US9189588B2Polygon-based optical proximity correctionTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 17, 2015·3 cites·20 claims
- 5082US8762899B2Method for metal correlated via split for double patterningLIN BURN JENG·Filed 2013·Granted Jun 24, 2014·4 cites·20 claims
Showing the top 50 of 102 patent records by PatentIndex Score.
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