Inventor · disambiguated record

Seungjoo Kwak

Also filed as: KWAK SEUNGJOO

1 granted patent·2 citations·filing 2011–2011

18Inventor score

Technology areasH10W

Files withHAN BONGHWAN1

Top patents by PatentIndex Score

1 record

0146US8609525B2Integrated circuit packaging system with interconnects and method of manufacture thereofHAN BONGHWAN·Filed 2011·Granted Dec 17, 2013·2 cites·10 claims

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