Inventor · disambiguated record

Bonghwan Han

Also filed as: HAN BONGHWAN

1 granted patent·2 citations·filing 2011–2011

18Inventor score

Technology areasH10W

Files withHAN BONGHWAN1

Top patents by PatentIndex Score

1 record

0146US8609525B2Integrated circuit packaging system with interconnects and method of manufacture thereofHAN BONGHWAN·Filed 2011·Granted Dec 17, 2013·2 cites·10 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →