Inventor · disambiguated record
Jin Seok Moon
Also filed as: MOON JIN S · MOON JIN SEOK
6 granted patents·24 pending applications·16 citations·filing 2005–2019
75Inventor score
Files withSAMSUNG ELECTRO MECH25MOON JIN-SEOK2IL DONG PHARMA1LEE KEUN YONG1SAMSUNG ELECTRONICS CO LTD1
Top patents by PatentIndex Score
30 records- 0182US7480980B2Planar magnetic inductor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Granted Jan 27, 2009·12 cites·8 claims
- 0277US8822832B2Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted Sep 2, 2014·2 cites·21 claims
- 0363US7675756B2Thin film-capacitor-embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Mar 9, 2010·2 cites·12 claims
- 0454US7886436B2Thin film capacitor-embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Granted Feb 15, 2011·0 cites·11 claims
- 0551US2022409677A1Novel probiotic composition for regulation of intestinal immunityIL DONG PHARMA·Filed 2019·Application pending·0 cites
- 0650US9107307B2Resin composition for printed circuit board, insulating film, prepreg, and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 11, 2015·0 cites·14 claims
- 0750US2014106147A1Prepreg, copper clad laminate, and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0848US2014066545A1Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 0948US2013146344A1Insulating resin composition for printed circuit board and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1047US7737529B2Printed circuit board with film capacitor embedded therein and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Jun 15, 2010·0 cites·18 claims
- 1147US2015057393A1Insulating resin composition for printed circuit board and products manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1247US2014063427A1Resin composition for thermal radiation board and thermal radiation board comprising the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1347US2014367147A1Insulating resin composition for printed circuit board, insulating film, prepreg and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1446US2015147542A1Resin composition for printed circuit board and printed circuit board comprising the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1546US2015104630A1Prepreg for printed circuit board, manufacturing method thereof, and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1646US2015060115A1Copper clad laminate for printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1746US2015065608A1Insulating resin composition for printed circuit board and products manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1845US2015114693A1Insulating resin composition for printed circuit board and products manufactured by using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1945US2014002226A1Inductor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2045US2014034367A1Epoxy resin composition for pritned circuit board, insulating film, prepreg, and multilayer printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2144US2009057860A1Semiconductor memory packageSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2244US2014127483A1Copper-clad laminate. method for manufacturing the same, and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2344US2006152321A1Planar magnetic inductor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 2442US2015107760A1Carrier and method of manufacturing printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2541US2014079924A1Resin composition for package substrate and package substrate comprising core layer and prepreg using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2637US2007094871A1Method for manufacturing a printed circuit board with a film capacitor embedded therein, and a printed circuit board obtained therebySAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2736US2013334330A1Method of controlling boilerMOON JIN SEOK·Filed 2013·Application pending·0 cites
- 2835US2011172357A1Composition for forming substrate, and prepreg and substrate using the sameLEE KEUN YONG·Filed 2010·Application pending·0 cites
- 2934US2010173679A1Apparatus and method for controlling turning on/off operation of display unit in portable terminalSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 3034US2012081254A1Antenna device for portable terminalMOON JIN-SEOK·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →