Inventor · disambiguated record
Shing-Fun Ho
Also filed as: HO SHING-FUN
8 granted patents·1 pending application·46 citations·filing 2005–2018
84Inventor score
Top patents by PatentIndex Score
9 records- 0185US7528482B2Embedded chip package with improved heat dissipation performance and method of making the sameNAN YA PRINTED CIRCUIT BOARD C·Filed 2007·Granted May 5, 2009·18 cites·11 claims
- 0282US7531263B2Method of fabricating a flat panel direct methanol fuel cellNAN YA PRINTED CIRCUIT BOARD C·Filed 2005·Granted May 12, 2009·6 cites·9 claims
- 0380US7592093B2Method for manufacturing a flat panel direct methanol fuel cellNAN YA PRINTED CIRCUIT BOARD C·Filed 2005·Granted Sep 22, 2009·5 cites·11 claims
- 0477US7045460B1Method for fabricating a packaging substrateNAN YA PRINTED CIRCUIT BOARD C·Filed 2005·Granted May 16, 2006·10 cites·8 claims
- 0565US7524429B2Method of manufacturing double-sided printed circuit boardNAN YA PRINTED CIRCUIT BOARD C·Filed 2006·Granted Apr 28, 2009·5 cites·6 claims
- 0656US10269692B1Package structure and method of forming the sameNAN YA PRINTED CIRCUIT BOARD CORP·Filed 2018·Granted Apr 23, 2019·1 cites·15 claims
- 0753US7576287B2Lot traceable printed circuit boardNAN YA PRINTED CIRCUIT BOARD C·Filed 2007·Granted Aug 18, 2009·1 cites·7 claims
- 0852US7597979B2Structure of integrated packed fuel cellNAN YA PRINTED CIRCUIT BOARD C·Filed 2005·Granted Oct 6, 2009·0 cites·14 claims
- 0929US2006054588A1Method of Manufacturing Double-Sided Printed Circuit BoardHSU HUNG-EN·Filed 2005·Application pending·0 cites
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