Inventor · disambiguated record
Junpei Fujiwara
Also filed as: FUJIWARA JUNPEI
11 granted patents·1 pending application·2 citations·filing 2011–2021
78Inventor score
Top patents by PatentIndex Score
12 records- 0185US11623424B2Resin sheet having capillaceous bodies and molded product thereofDENKA COMPANY LTD·Filed 2018·Granted Apr 11, 2023·2 cites·17 claims
- 0259US9908311B2Water-repellent, thermoplastic resin sheet, and molded articleDENKA COMPANY LTD·Filed 2013·Granted Mar 6, 2018·0 cites·16 claims
- 0355US10137660B2Water-repellent, thermoplastic resin sheet, and molded articleDENKA COMPANY LTD·Filed 2013·Granted Nov 27, 2018·0 cites·20 claims
- 0452US12154818B2Layered sheet, container, carrier tape, and electronic component packaging bodyDENKA COMPANY LTD·Filed 2021·Granted Nov 26, 2024·0 cites·19 claims
- 0551US11904518B2Thermoplastic resin sheet having hairlike bodies and molded product thereofDENKA COMPANY LTD·Filed 2017·Granted Feb 20, 2024·0 cites·13 claims
- 0646US12036715B2Thermoplastic resin sheet having hairlike bodies and molded product thereofDENKA COMPANY LTD·Filed 2019·Granted Jul 16, 2024·0 cites·2 claims
- 0746US11701874B2Layered sheet, electronic component packaging container, and electronic component packagingDENKA COMPANY LTD·Filed 2020·Granted Jul 18, 2023·0 cites·11 claims
- 0846US2021130653A1Multilayer film and heat-resistant adhesive tapeDENKA COMPANY LTD·Filed 2018·Application pending·0 cites
- 0945US8999470B2Surface conductive laminated sheet and electronic part packaging containerFUJIWARA JUNPEI·Filed 2011·Granted Apr 7, 2015·0 cites·14 claims
- 1044US9028938B2Styrene resin composition, and molded article thereofFUJIWARA JUNPEI·Filed 2011·Granted May 12, 2015·0 cites·5 claims
- 1144US9028939B2Laminated sheet for packaging electronic component and molded body thereofFUJIWARA JUNPEI·Filed 2012·Granted May 12, 2015·0 cites·6 claims
- 1235US10202506B2Electronic component packaging sheet, and formed article thereofFUJIWARA JUNPEI·Filed 2011·Granted Feb 12, 2019·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →