Inventor · disambiguated record
Paul A. Farrar
Also filed as: FARRAR PAUL · FARRAR PAUL A · FARRAR PAUL ALDEN · FARRAR SR PAUL A
217 granted patents·34 pending applications·7,030 citations·filing 1974–2020
99Inventor score
Top patents by PatentIndex Score
251 records- 0198US7195999B2Metal-substituted transistor gatesMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 27, 2007·105 cites·61 claims
- 0298US6413827B2Low dielectric constant shallow trench isolationFiled 2000·Granted Jul 2, 2002·124 cites·35 claims
- 0398US6356500B1Reduced power DRAM device and methodMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 12, 2002·180 cites·39 claims
- 0498US5891797AMethod of forming a support structure for air bridge wiring of an integrated circuitMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 6, 1999·268 cites·4 claims
- 0597US7952184B2Distributed semiconductor device methods, apparatus, and systemsMICRON TECHNOLOGY INC·Filed 2006·Granted May 31, 2011·41 cites·16 claims
- 0697US7485544B2Strained semiconductor, devices and systems and methods of formationMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 3, 2009·44 cites·35 claims
- 0797US6686654B2Multiple chip stack structure and cooling systemMICRON TECHNOLOGY INC·Filed 2001·Granted Feb 3, 2004·138 cites·41 claims
- 0897US6614092B2Microelectronic device package with conductive elements and associated method of manufactureMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 2, 2003·135 cites·31 claims
- 0997US6249460B1Dynamic flash memory cells with ultrathin tunnel oxidesMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 19, 2001·144 cites·68 claims
- 1097US6025261AMethod for making high-Q inductive elementsMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 15, 2000·135 cites·42 claims
- 1197US5270261AThree dimensional multichip package methods of fabricationIBM·Filed 1992·Granted Dec 14, 1993·332 cites·15 claims
- 1296US7875529B2Semiconductor devicesMICRON TECHNOLOGY INC·Filed 2007·Granted Jan 25, 2011·47 cites·13 claims
- 1396US6579738B2Method of alignment for buried structures formed by surface transformation of empty spaces in solid state materialsMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 17, 2003·82 cites·50 claims
- 1496US6456535B2Dynamic flash memory cells with ultra thin tunnel oxidesMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 24, 2002·110 cites·93 claims
- 1596US6420262B1Structures and methods to enhance copper metallizationMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 16, 2002·73 cites·50 claims
- 1696US6077792AMethod of forming foamed polymeric material for an integrated circuitMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 20, 2000·163 cites·32 claims
- 1796US5202754AThree-dimensional multichip packages and methods of fabricationIBM·Filed 1991·Granted Apr 13, 1993·256 cites·6 claims
- 1896US5126006APlural level chip maskingIBM·Filed 1991·Granted Jun 30, 1992·133 cites·35 claims
- 1996US4423547AMethod for forming dense multilevel interconnection metallurgy for semiconductor devicesIBM·Filed 1981·Granted Jan 3, 1984·245 cites·8 claims
- 2095US7301221B2Controlling diffusion in doped semiconductor regionsMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 27, 2007·27 cites·26 claims
- 2195US6383924B1Method of forming buried conductor patterns by surface transformation of empty spaces in solid state materialsMICRON TECHNOLOGY INC·Filed 2000·Granted May 7, 2002·97 cites·45 claims
- 2295US6376370B1Process for providing seed layers for using aluminum, copper, gold and silver metallurgy process for providing seed layers for using aluminum, copper, gold and silver metallurgyMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 23, 2002·73 cites·45 claims
- 2394US7535103B2Structures and methods to enhance copper metallizationMICRON TECHNOLOGY INC·Filed 2006·Granted May 19, 2009·15 cites·21 claims
- 2494US6696746B1Buried conductorsMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 24, 2004·132 cites·31 claims
- 2594US6670719B2Microelectronic device package filled with liquid or pressurized gas and associated method of manufactureMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 30, 2003·70 cites·40 claims
- 2694US6424034B1High performance packaging for microprocessors and DRAM chips which minimizes timing skewsMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 23, 2002·208 cites·37 claims
- 2794US5478781APolyimide-insulated cube package of stacked semiconductor device chipsIBM·Filed 1994·Granted Dec 26, 1995·174 cites·36 claims
- 2893US7754532B2High density chip packages, methods of forming, and systems including sameMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 13, 2010·21 cites·35 claims
- 2993US7504674B2Electronic apparatus having a core conductive structure within an insulating layerMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 17, 2009·23 cites·50 claims
- 3093US7190616B2In-service reconfigurable DRAM and flash memory deviceMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 13, 2007·57 cites·26 claims
- 3193US6426289B1Method of fabricating a barrier layer associated with a conductor layer in damascene structuresMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 30, 2002·71 cites·45 claims
- 3292US6747347B2Multi-chip electronic package and cooling systemMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 8, 2004·54 cites·62 claims
- 3392US6635960B2Angled edge connections for multichip structuresMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 21, 2003·56 cites·9 claims
- 3492US6614099B2Copper metallurgy in integrated circuitsMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 2, 2003·50 cites·25 claims
- 3591US8872324B2Distributed semiconductor device methods, apparatus, and systemsMICRON TECHNOLOGY INC·Filed 2014·Granted Oct 28, 2014·8 cites·20 claims
- 3691US7322511B2Apparatus and method for printing micro metal structuresMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 29, 2008·12 cites·25 claims
- 3791US6525413B1Die to die connection method and assemblies and packages including dice so connectedMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 25, 2003·113 cites·117 claims
- 3891US6433413B1Three-dimensional multichip moduleMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 13, 2002·51 cites·34 claims
- 3991US5313097AHigh density memory moduleIBM·Filed 1992·Granted May 17, 1994·184 cites·20 claims
- 4090US7411823B2In-service reconfigurable DRAM and flash memory deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 12, 2008·11 cites·20 claims
- 4190US6781192B2Low dielectric constant shallow trench isolationMICRON TECHNOLOGY INC·Filed 2002·Granted Aug 24, 2004·35 cites·30 claims
- 4290US5994777AMethod and support structure for air bridge wiring of an integrated circuitMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 30, 1999·91 cites·7 claims
- 4389US7297617B2Method for controlling diffusion in semiconductor regionsMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 20, 2007·34 cites·37 claims
- 4489US6510080B1Three terminal magnetic random access memoryMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 21, 2003·43 cites·73 claims
- 4589US6288442B1Integrated circuit with oxidation-resistant polymeric layerMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 11, 2001·67 cites·14 claims
- 4689US3959047AMethod for constructing a rom for redundancy and other applicationsIBM·Filed 1974·Granted May 25, 1976·67 cites·10 claims
- 4788US6451683B1Damascene structure and method of makingMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 17, 2002·39 cites·36 claims
- 4887US8470642B2High density chip packages, methods of forming, and systems including sameFARRAR PAUL A·Filed 2010·Granted Jun 25, 2013·7 cites·20 claims
- 4987US7968960B2Methods of forming strained semiconductor channelsMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 28, 2011·9 cites·66 claims
- 5087US6740392B1Surface barriers for copper and silver interconnects produced by a damascene processMICRON TECHNOLOGY INC·Filed 2003·Granted May 25, 2004·37 cites·37 claims
Showing the top 50 of 251 patent records by PatentIndex Score.
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