Inventor · disambiguated record
Hiromitsu Tanabe
Also filed as: TANABE HIROMITSU
20 granted patents·110 citations·filing 2009–2022
93Inventor score
Top patents by PatentIndex Score
20 records- 0194US10256234B2Semiconductor deviceDENSO CORP·Filed 2016·Granted Apr 9, 2019·11 cites·14 claims
- 0292US8242536B2Semiconductor deviceTANABE HIROMITSU·Filed 2010·Granted Aug 14, 2012·17 cites·19 claims
- 0391US8080853B2Semiconductor device including insulated gate bipolar transistor and diodeTSUZUKI YUKIO·Filed 2009·Granted Dec 20, 2011·21 cites·9 claims
- 0489US8841699B2Semiconductor device including insulated gate bipolar transistor and diodeTSUZUKI YUKIO·Filed 2012·Granted Sep 23, 2014·11 cites·6 claims
- 0589US8614483B2Insulated gate semiconductor deviceTANABE HIROMITSU·Filed 2011·Granted Dec 24, 2013·14 cites·33 claims
- 0685US8847276B2Semiconductor deviceTANABE HIROMITSU·Filed 2011·Granted Sep 30, 2014·8 cites·18 claims
- 0784US8288824B2Semiconductor device including insulated gate bipolar transistor and diodeTSUZUKI YUKIO·Filed 2011·Granted Oct 16, 2012·7 cites·7 claims
- 0879US9224730B2Semiconductor deviceDENSO CORP·Filed 2014·Granted Dec 29, 2015·4 cites·9 claims
- 0978US8729600B2Insulated gate bipolar transistor (IGBT) with hole stopper layerTSUZUKI YUKIO·Filed 2012·Granted May 20, 2014·5 cites·7 claims
- 1078US8648385B2Semiconductor deviceKOUNO KENJI·Filed 2011·Granted Feb 11, 2014·5 cites·7 claims
- 1175US9847409B2Semiconductor device and manufacturing method for the sameDENSO CORP·Filed 2015·Granted Dec 19, 2017·3 cites·5 claims
- 1274US10658360B2Semiconductor device with an insulated-gate bipolar transistor region and a diode regionFUJI ELECTRIC CO LTD·Filed 2017·Granted May 19, 2020·2 cites·3 claims
- 1368US10629678B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Apr 21, 2020·1 cites·13 claims
- 1466US9761663B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Sep 12, 2017·1 cites·10 claims
- 1565US11869961B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·9 claims
- 1652US11264490B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Mar 1, 2022·0 cites·13 claims
- 1750US12389615B2Semiconductor deviceDENSO CORP·Filed 2022·Granted Aug 12, 2025·0 cites·8 claims
- 1846US9437678B2Fabrication method of semiconductor device, evaluation method of semiconductor device, and semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2015·Granted Sep 6, 2016·0 cites·9 claims
- 1941US10256212B2Semiconductor chip having multiple pads and semiconductor module including the sameDENSO CORP·Filed 2016·Granted Apr 9, 2019·0 cites·3 claims
- 2038US11121241B2Semiconductor deviceDENSO CORP·Filed 2016·Granted Sep 14, 2021·0 cites·6 claims
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