Inventor · disambiguated record
Kazushige Sato
Also filed as: SATO KAZUSHIGE
48 granted patents·3 pending applications·430 citations·filing 1990–2025
98Inventor score
Files withHITACHI LTD17MURATA MANUFACTURING CO11RENESAS TECH CORP7MIYAKOSHI PRINTING MACHINERY CO LTD6SUBARU CORP5
Top patents by PatentIndex Score
51 records- 0197US6809399B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Oct 26, 2004·109 cites·10 claims
- 0292US7910427B1Semiconductor integrated circuit device and process for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Mar 22, 2011·8 cites·7 claims
- 0388US7456486B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Nov 25, 2008·8 cites·19 claims
- 0488US7253051B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2005·Granted Aug 7, 2007·8 cites·17 claims
- 0587US10518558B1Drying device and ink-jet printing device equipped with the sameMIYAKOSHI PRINTING MACHINERY CO LTD·Filed 2018·Granted Dec 31, 2019·3 cites·8 claims
- 0686US6548885B2Semiconductor integrated circuit device and process for manufacturing the sameHITACHI LTD·Filed 2001·Granted Apr 15, 2003·22 cites·43 claims
- 0785US5523598ASemiconductor integrated circuit deviceHITACHI LTD·Filed 1994·Granted Jun 4, 1996·53 cites·22 claims
- 0883US5754467ASemiconductor integrated circuit device and process for manufacturing the sameHITACHI LTD·Filed 1995·Granted May 19, 1998·38 cites·34 claims
- 0982US5946565ASemiconductor integrated circuit device and process for manufacturing the sameHITACHI LTD·Filed 1997·Granted Aug 31, 1999·34 cites·58 claims
- 1081US7049680B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted May 23, 2006·14 cites·20 claims
- 1174US11492130B2Redundant propulsion device and electric aircraftSUBARU CORP·Filed 2020·Granted Nov 8, 2022·1 cites·20 claims
- 1274US11419211B2Circuit module and manufacturing method for circuit moduleMURATA MANUFACTURING CO·Filed 2019·Granted Aug 16, 2022·3 cites·11 claims
- 1374US10861759B2Circuit moduleMURATA MANUFACTURING CO·Filed 2019·Granted Dec 8, 2020·3 cites·19 claims
- 1473US7511377B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Mar 31, 2009·2 cites·36 claims
- 1572US8133780B2Semiconductor integrated circuit device and process for manufacturing the sameIKEDA SHUJI·Filed 2011·Granted Mar 13, 2012·1 cites·18 claims
- 1670US2025260157A1Antenna module and communication apparatus including the sameMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 1769US5798551ASemiconductor integrated circuit device and method of manufacturing the sameHITACHI LTD·Filed 1997·Granted Aug 25, 1998·23 cites·28 claims
- 1866US12315993B2Communication device including a pressing member in contact with a cover member and a dielectric substrateMURATA MANUFACTURING CO·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 1965US5607866AMethod of fabricating a semiconductor device having silicide layers for electrodesHITACHI LTD·Filed 1995·Granted Mar 4, 1997·26 cites·15 claims
- 2062US11030360B2Aircraft designing method, aircraft designing program and aircraft designing apparatusSUBARU CORP·Filed 2015·Granted Jun 8, 2021·2 cites·9 claims
- 2162US2025350311A1Radio frequency module and communication deviceMURATA MANUFACTURING CO·Filed 2025·Application pending·0 cites
- 2259US6337517B1Semiconductor device and method of fabricating sameHITACHI LTD·Filed 1998·Granted Jan 8, 2002·21 cites·6 claims
- 2358US11895769B2Module, terminal assembly, and method for producing moduleMURATA MANUFACTURING CO·Filed 2021·Granted Feb 6, 2024·0 cites·14 claims
- 2458US7834420B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Nov 16, 2010·0 cites·26 claims
- 2557US11749589B2ModuleMURATA MANUFACTURING CO·Filed 2021·Granted Sep 5, 2023·0 cites·15 claims
- 2656US7397123B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Jul 8, 2008·0 cites·19 claims
- 2755US8093681B2Semiconductor integrated circuit device and process for manufacturing the sameIKEDA SHUJI·Filed 2011·Granted Jan 10, 2012·0 cites·11 claims
- 2854US10663226B2Heating drum and ink-jet printing device equipped with the sameMIYAKOSHI PRINTING MACHINERY CO LTD·Filed 2018·Granted May 26, 2020·0 cites·7 claims
- 2954US6211004B1Semiconductor integrated circuit device and process for manufacturing the sameHITACHI LTD·Filed 1999·Granted Apr 3, 2001·8 cites·27 claims
- 3053US10759194B2Drying device and ink-jet printing device equipped with the sameMIYAKOSHI PRINTING MACHINERY CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·8 claims
- 3152US6661063B2Semiconductor integrated circuit deviceHITACHI LTD·Filed 2001·Granted Dec 9, 2003·6 cites·19 claims
- 3250US10843487B2Ink drying apparatus for drying ink by heat after printingMIYAKOSHI PRINTING MACHINERY CO LTD·Filed 2019·Granted Nov 24, 2020·0 cites·9 claims
- 3350US6747324B2Method of manufacturing a semiconductor integrated circuit deviceHITACHI LTD·Filed 2003·Granted Jun 8, 2004·5 cites·9 claims
- 3448US11631645B2Circuit module and manufacturing method thereforMURATA MANUFACTURING CO·Filed 2019·Granted Apr 18, 2023·0 cites·15 claims
- 3548US10818566B2Circuit moduleMURATA MANUFACTURING CO·Filed 2019·Granted Oct 27, 2020·0 cites·6 claims
- 3647US10741465B2Circuit module and method of manufacturing the sameMURATA MANUFACTURING CO·Filed 2019·Granted Aug 11, 2020·0 cites·7 claims
- 3746US11584508B2Rotating device and aircraftSUBARU CORP·Filed 2020·Granted Feb 21, 2023·0 cites·12 claims
- 3845US10757845B2High-frequency component provided with a shield caseMURATA MANUFACTURING CO·Filed 2019·Granted Aug 25, 2020·0 cites·6 claims
- 3944US7075157B2Method of manufacturing a semiconductor integrated circuit deviceHITACHI LTD·Filed 2004·Granted Jul 11, 2006·3 cites·3 claims
- 4044US7022568B2Semiconductor integrated circuit device and process for manufacturing the sameHITACHI ULSI ENG CORP·Filed 2004·Granted Apr 4, 2006·0 cites·23 claims
- 4144US7023071B2Semiconductor integrated circuit device and process for manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Apr 4, 2006·0 cites·30 claims
- 4244US6544884B2Semiconductor device and method of fabricating sameHITACHI LTD·Filed 2001·Granted Apr 8, 2003·2 cites·3 claims
- 4344US6171892B1Method of manufacturing a semiconductor integrated circuit deviceHITACHI LTD·Filed 1998·Granted Jan 9, 2001·6 cites·32 claims
- 4442US5055904ASemiconductor deviceHITACHI LTD·Filed 1990·Granted Oct 8, 1991·8 cites·7 claims
- 4541US10960673B2Inkjet printerMIYAKOSHI PRINTING MACHINERY CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·7 claims
- 4640US6603178B2Semiconductor integrated circuit device and method of manufacture thereofHITACHI LTD·Filed 2001·Granted Aug 5, 2003·2 cites·14 claims
- 4740US5371023AGate circuit, semiconductor integrated circuit device and method of fabrication thereof, semiconductor memory and microprocessorHITACHI LTD·Filed 1992·Granted Dec 6, 1994·7 cites·13 claims
- 4839US9975643B2Intake structure of aircraftSUBARU CORP·Filed 2016·Granted May 22, 2018·0 cites·8 claims
- 4935US5506156AMethod of fabricating bipolar transistor having high speed and MOS transistor having small sizeHITACHI LTD·Filed 1994·Granted Apr 9, 1996·4 cites·10 claims
- 5034US2018293347A1Intake designing method, non-transitory computer readable medium, and intake designing apparatusSUBARU CORP·Filed 2018·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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