Inventor · disambiguated record
Young-Shin Kwon
Also filed as: KWON YOUNG S · KWON YOUNG-SHIN
13 granted patents·5 pending applications·732 citations·filing 1994–2024
93Inventor score
Top patents by PatentIndex Score
18 records- 0195US6552423B2Higher-density memory cardSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 22, 2003·219 cites·29 claims
- 0295US6483038B2Memory cardSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Nov 19, 2002·142 cites·16 claims
- 0395US5594275AJ-leaded semiconductor package having a plurality of stacked ball grid array packagesSAMSUNG ELECTRONICS CO LTD·Filed 1994·Granted Jan 14, 1997·281 cites·10 claims
- 0494US8853694B2Chip on film package including test pads and semiconductor devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Oct 7, 2014·20 cites·11 claims
- 0593US11779940B1Systems, methods and apparatus for dispensing fluid to an objectSONIX INC·Filed 2020·Granted Oct 10, 2023·4 cites·10 claims
- 0691US9113545B2Tape wiring substrate and chip-on-film package including the sameHAN SANG-UK·Filed 2012·Granted Aug 18, 2015·15 cites·16 claims
- 0784US7659936B2Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 9, 2010·6 cites·14 claims
- 0874US12417935B1Systems, methods and apparatus for dispensing fluid to an objectSONIX INC·Filed 2023·Granted Sep 16, 2025·0 cites·15 claims
- 0973USD445797SMemory cardSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jul 31, 2001·19 cites·1 claims
- 1067US7405760B2Image pickup device with non-molded DSP chip and manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jul 29, 2008·15 cites·18 claims
- 1161US6617700B2Repairable multi-chip package and high-density memory card having the packageSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Sep 9, 2003·10 cites·14 claims
- 1257US2024329004A1Multi-holder inspection system using moveable support structureSONIX INC·Filed 2024·Application pending·0 cites
- 1351US8054370B2Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·1 cites·2 claims
- 1451US2010019372A1Semiconductor device package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1543US2021356439A1System, Method and Apparatus for Ultrasonic InspectionSONIX INC·Filed 2019·Application pending·0 cites
- 1640US8278154B2Method of fabricating a semiconductor device package including a heat radiation plateYOUN HAN-SHIN·Filed 2011·Granted Oct 2, 2012·0 cites·9 claims
- 1738US2013193545A1Semiconductor apparatus and image sensor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1832US2009315130A1Solid-state imaging apparatus and method for manufacturing the sameRO YOUNG-HOON·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →