Inventor · disambiguated record
Shou-Jui Hsiang
Also filed as: HSIANG SHOU-JUI
17 granted patents·14 pending applications·7 citations·filing 2010–2021
86Inventor score
Files withZHEN DING TECH CO LTD26LIN CHIH-MING2ASIA ELECTRONIC MATERIAL CO1FUKUI PREC COMPONENT (SHENZHEN) CO LTD1IND TECH RES INST1
Top patents by PatentIndex Score
31 records- 0188US10894882B2Low dielectric resin composition, film and circuit board using the sameZHEN DING TECH CO LTD·Filed 2018·Granted Jan 19, 2021·2 cites·12 claims
- 0280US8536460B2Composite double-sided copper foil substrates and flexible printed circuit board structures using the sameLIN CHIH-MING·Filed 2010·Granted Sep 17, 2013·3 cites·7 claims
- 0374US9593207B2Polyamic acid, polyimide, and method for manufacturing graphite sheetIND TECH RES INST·Filed 2014·Granted Mar 14, 2017·2 cites·16 claims
- 0472US11261328B2Circuit board using low dielectric resin compositionZHEN DING TECH CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·10 claims
- 0568US10822522B2Modified polyimide compound, resin composition and polyimide filmZHEN DING TECH CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·9 claims
- 0665US11680138B2Polymer dispersion, method for manufacturing the polymer dispersion, and method for manufacturing polymer composite filmZHEN DING TECH CO LTD·Filed 2020·Granted Jun 20, 2023·0 cites·14 claims
- 0765US11655366B2Transparent polyimide mixture, method for manufacturing the transparent polyimide mixture, and method for manufacturing transparent polyimide filmZHEN DING TECH CO LTD·Filed 2020·Granted May 23, 2023·0 cites·15 claims
- 0861US10428238B2Resin composition, polyimide film and method for manufacturing polyimide filmZHEN DING TECH CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·5 claims
- 0958US11859038B2Method for manufacturing a block copolymer of polyamide acidZHEN DING TECH CO LTD·Filed 2020·Granted Jan 2, 2024·0 cites·2 claims
- 1057US10875984B2Inorganic shell, resin composition, and method for making inorganic shellZHEN DING TECH CO LTD·Filed 2017·Granted Dec 29, 2020·0 cites·18 claims
- 1156US2023091989A1Diamine monomer compound, method for preparing the same, resin, flexible film, and electronic deviceZHEN DING TECH CO LTD·Filed 2021·Application pending·0 cites
- 1256US2022135797A1Polyimide film and method for manufacturing sameZHEN DING TECH CO LTD·Filed 2020·Application pending·0 cites
- 1355US2022033663A1Fluorine-containing dispersion and method of manufacturing the same, and fluorine-containing composite filmZHEN DING TECH CO LTD·Filed 2020·Application pending·0 cites
- 1454US2021363384A1Liquid crystal polymer composition, copper substrate, and method for manufacturing the copper substrateZHEN DING TECH CO LTD·Filed 2020·Application pending·0 cites
- 1554US2022002490A1Polyimide component, polyimide film, and polyimide copper clad laminateZHEN DING TECH CO LTD·Filed 2020·Application pending·0 cites
- 1653US11602921B2Elastic conductive composite fabric capable of detecting and providing electrical signals according to reflections of limbs and body movementsZHEN DING TECH CO LTD·Filed 2019·Granted Mar 14, 2023·0 cites·1 claims
- 1752US11524491B2Method for manufacturing thick polyimide filmZHEN DING TECH CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·11 claims
- 1852US2023086746A1Diamine monomer compound, method for preparing the same, resin, flexible film, and electronic deviceZHEN DING TECH CO LTD·Filed 2021·Application pending·0 cites
- 1950US2021017336A1Polyamic acid composition, polyimide film, and copper clad laminateZHEN DING TECH CO LTD·Filed 2019·Application pending·0 cites
- 2047US10844174B2Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the sameZHEN DING TECH CO LTD·Filed 2017·Granted Nov 24, 2020·0 cites·1 claims
- 2146US10423069B2Water soluble photosensitive resin composition and film using sameZHEN DING TECH CO LTD·Filed 2017·Granted Sep 24, 2019·0 cites·20 claims
- 2246US2019352456A1Modified liquid crystal polymer, polymeric film, and method for manufacturing the modified liquid crystal polymerZHEN DING TECH CO LTD·Filed 2018·Application pending·0 cites
- 2341US10329368B2Photosensitive resin composition, and film and printed circuit board using sameZHEN DING TECH CO LTD·Filed 2017·Granted Jun 25, 2019·0 cites·17 claims
- 2441US2010330321A1Cover layer for printed circuit boardASIA ELECTRONIC MATERIAL CO·Filed 2010·Application pending·0 cites
- 2540US8765258B2Cover filmLIN CHIH-MING·Filed 2010·Granted Jul 1, 2014·0 cites·12 claims
- 2637US10928730B2Photosensitive resin composition, and polymer film made therefromZHEN DING TECH CO LTD·Filed 2018·Granted Feb 23, 2021·0 cites·12 claims
- 2737US2017369747A1Resin composition, adhesive film, and circuit board using the sameZHEN DING TECH CO LTD·Filed 2016·Application pending·0 cites
- 2835US2018223048A1Resin composition, method for making resin composition and film for circuit board, and circuit boardZHEN DING TECH CO LTD·Filed 2017·Application pending·0 cites
- 2932US2017369653A1Polyamic acid, polyimide, polyimide film and copper clad laminate using the sameZHEN DING TECH CO LTD·Filed 2017·Application pending·0 cites
- 3031US2018203350A1Photosensitive resin composition, method for making photosensitive resin composition, and method for making printed circuit board therewithZHEN DING TECH CO LTD·Filed 2017·Application pending·0 cites
- 3129US2017079136A1Circuit board and method for making the sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Application pending·0 cites
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