Inventor · disambiguated record
Heung-Kyu Kwon
Also filed as: KWON HEUNG K · KWON HEUNG-KYU
48 granted patents·18 pending applications·932 citations·filing 1993–2019
98Inventor score
Top patents by PatentIndex Score
66 records- 0198US8508954B2Systems employing a stacked semiconductor packageKWON HEUNG-KYU·Filed 2010·Granted Aug 13, 2013·60 cites·7 claims
- 0298US6187615B1Chip scale packages and methods for manufacturing the chip scale packages at wafer levelSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Feb 13, 2001·364 cites·20 claims
- 0397US7327038B2Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 5, 2008·69 cites·24 claims
- 0494US8604614B2Semiconductor packages having warpage compensationKWON HEUNG-KYU·Filed 2011·Granted Dec 10, 2013·19 cites·17 claims
- 0594US7795743B2Wiring substrate having variously sized ball pads, semiconductor package having the wiring substrate, and stack package using the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 14, 2010·37 cites·26 claims
- 0692US8546954B2Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor packageKWON HEUNG-KYU·Filed 2011·Granted Oct 1, 2013·13 cites·33 claims
- 0791US9839127B2System of package (SoP) module and mobile computing device having the SoPKWON HEUNG KYU·Filed 2015·Granted Dec 5, 2017·9 cites·11 claims
- 0890US9984032B2System on package (SoP) having through silicon via (TSV) interposer with memory controller connected to multiple printed circuit boards (PCB)SAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 29, 2018·7 cites·20 claims
- 0989US8716872B2Stacked semiconductor package including connections electrically connecting first and second semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 6, 2014·8 cites·19 claims
- 1088US7327020B2Multi-chip package including at least one semiconductor device enclosed thereinSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 5, 2008·18 cites·6 claims
- 1186US9811122B2Package on packages and mobile computing devices having the sameKWON HEUNG KYU·Filed 2015·Granted Nov 7, 2017·5 cites·16 claims
- 1286US9048168B2Semiconductor packages having warpage compensationSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 2, 2015·7 cites·20 claims
- 1386US7868443B2Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 11, 2011·11 cites·20 claims
- 1486US6943430B2Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Sep 13, 2005·36 cites·23 claims
- 1584US10025354B2System module and mobile computing device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 17, 2018·4 cites·20 claims
- 1684US9665122B2Semiconductor device having markings and package on package including the sameKWON HEUNG KYU·Filed 2015·Granted May 30, 2017·6 cites·20 claims
- 1784US9042115B2Stacked semiconductor packagesKWON HEUNG-KYU·Filed 2013·Granted May 26, 2015·4 cites·17 claims
- 1882US8680667B2Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elementsKWON HEUNG-KYU·Filed 2012·Granted Mar 25, 2014·5 cites·31 claims
- 1982US7541680B2Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 2, 2009·13 cites·9 claims
- 2081US8618671B2Semiconductor packages having passive elements mounted thereontoKWON HEUNG-KYU·Filed 2010·Granted Dec 31, 2013·6 cites·11 claims
- 2181US6952050B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Oct 4, 2005·27 cites·6 claims
- 2280US8400779B2Semiconductor package having multi pitch ball landKIM TONG-SUK·Filed 2010·Granted Mar 19, 2013·6 cites·27 claims
- 2379US9040351B2Stack packages having fastening element and halogen-free inter-package connectorSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 26, 2015·4 cites·20 claims
- 2479US7615415B2Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 10, 2009·7 cites·15 claims
- 2577US7994643B2Stack package, a method of manufacturing the stack package, and a digital device having the stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 9, 2011·7 cites·21 claims
- 2677US7928555B2Stack semiconductor package including an interposer chip having an imposed diode or capacitorSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Apr 19, 2011·7 cites·8 claims
- 2777US7211469B2Semiconductor wafer having electrically connected passive device chips, passive devices and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 1, 2007·6 cites·20 claims
- 2877US6518660B2Semiconductor package with ground projectionsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Feb 11, 2003·25 cites·15 claims
- 2976US7005320B2Method for manufacturing flip chip package devices with a heat spreaderSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Feb 28, 2006·23 cites·31 claims
- 3076US5250840ASemiconductor lead frame with a chip having bonding pads in a cross arrangementSAMSUNG ELECTRONICS CO LTD·Filed 1993·Granted Oct 5, 1993·54 cites·8 claims
- 3174US8698301B2Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor deviceKWON HEUNG-KYU·Filed 2012·Granted Apr 15, 2014·3 cites·13 claims
- 3273US8817486B2Semiconductor package having multi pitch ball landKIM TONG-SUK·Filed 2013·Granted Aug 26, 2014·3 cites·11 claims
- 3373US7078800B2Semiconductor packageSAMSUNG ELELCTRONICS CO LTD·Filed 2004·Granted Jul 18, 2006·19 cites·7 claims
- 3472US6903451B1Chip scale packages manufactured at wafer levelSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jun 7, 2005·18 cites·32 claims
- 3565US10593652B2Stacked semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 17, 2020·0 cites·17 claims
- 3665US9640499B2Semiconductor chip, flip chip package and wafer level package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 2, 2017·1 cites·17 claims
- 3764US9601458B2Stacked semiconductor package including connections electrically connecting first and second semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 21, 2017·1 cites·20 claims
- 3864US7258808B2High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 21, 2007·10 cites·15 claims
- 3961US6608380B2Semiconductor chip package having one or more sealing screwsSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Aug 19, 2003·10 cites·15 claims
- 4060US10403606B2Method of fabricating a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·17 claims
- 4157US9978721B2Apparatus for stacked semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 22, 2018·0 cites·15 claims
- 4255US8981581B2Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elementsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 17, 2015·0 cites·20 claims
- 4354US8963308B2Semiconductor packages including a plurality of upper semiconductor devices on a lower semiconductor deviceKWON HEUNG-KYU·Filed 2014·Granted Feb 24, 2015·0 cites·15 claims
- 4454US2015228627A1Stacked semiconductor packages, methods for fabricating the same, and /or systems employing the sameKWON HEUNG-KYU·Filed 2015·Application pending·0 cites
- 4553US2009317947A1Semiconductor package with heat sink, stack package using the same and manufacturing method thereofKWON HEUNG-KYU·Filed 2009·Application pending·0 cites
- 4652US7776650B2Method for fabricating a flip chip system in packageSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 17, 2010·0 cites·8 claims
- 4750US7812442B2High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Oct 12, 2010·0 cites·10 claims
- 4850US2013256916A1Semiconductor packages and methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4949US2005242426A1Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 5048US7517723B2Method for fabricating a flip chip system in packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 14, 2009·0 cites·20 claims
Showing the top 50 of 66 patent records by PatentIndex Score.
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