Inventor · disambiguated record
Yoshitaka Otsuka
Also filed as: OTSUKA YOSHITAKA
17 granted patents·2 pending applications·74 citations·filing 2007–2023
91Inventor score
Top patents by PatentIndex Score
19 records- 0194US12198963B2Bonding systemTOKYO ELECTRON LTD·Filed 2023·Granted Jan 14, 2025·2 cites·20 claims
- 0294US10985132B2Bonding apparatus, bonding system, bonding method and storage mediumTOKYO ELECTRON LTD·Filed 2020·Granted Apr 20, 2021·4 cites·14 claims
- 0393US10438920B2Bonding apparatus, bonding system, bonding method and storage mediumTOKYO ELECTRON LTD·Filed 2017·Granted Oct 8, 2019·12 cites·17 claims
- 0488US9158037B2Resin molded product, method of manufacturing the same, die for resin molded productOLYMPUS CORP·Filed 2013·Granted Oct 13, 2015·16 cites·16 claims
- 0586US8272452B2Hammering toolKATOU KOUJI·Filed 2008·Granted Sep 25, 2012·24 cites·8 claims
- 0684US9925705B2Molding die structure of molded article and manufacturing method of molded articleOLYMPUS CORP·Filed 2014·Granted Mar 27, 2018·5 cites·4 claims
- 0778US10160015B2Foreign substance removal apparatus and foreign substance detection apparatusTOKYO ELECTRON LTD·Filed 2016·Granted Dec 25, 2018·2 cites·4 claims
- 0873US11817338B2Bonding system and bonding methodTOKYO ELECTRON LTD·Filed 2019·Granted Nov 14, 2023·1 cites·8 claims
- 0970US11417543B2Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2019·Granted Aug 16, 2022·1 cites·7 claims
- 1067US8307778B2Coating method and coating unitINAMASU TOSHIFUMI·Filed 2007·Granted Nov 13, 2012·5 cites·20 claims
- 1160US10882234B2MoldOLYMPUS CORP·Filed 2019·Granted Jan 5, 2021·0 cites·3 claims
- 1260US9221222B2Molding die for multicolored molding, molding method of multicolored molded piece, and multicolored molded pieceOLYMPUS CORP·Filed 2013·Granted Dec 29, 2015·2 cites·16 claims
- 1359US10756046B2Bonding apparatus, bonding system, bonding method and storage mediumTOKYO ELECTRON LTD·Filed 2019·Granted Aug 25, 2020·0 cites·17 claims
- 1458US10946419B2Foreign substance removal apparatus and foreign substance detection apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Mar 16, 2021·0 cites·3 claims
- 1547US12451374B2Bonding system and inspection method of inspecting combined substrateTOKYO ELECTRON LTD·Filed 2020·Granted Oct 21, 2025·0 cites·10 claims
- 1643US10833045B2Substrate processing apparatus and manufacturing method of substrate holding unitTOKYO ELECTRON LTD·Filed 2018·Granted Nov 10, 2020·0 cites·5 claims
- 1742US2023086738A1Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 1835US10022926B2Injection molding method and injection molding dieOLYMPUS CORP·Filed 2016·Granted Jul 17, 2018·0 cites·2 claims
- 1935US2015226937A1Lens unit structure for molded lens and molding die for molded lensOLYMPUS CORP·Filed 2015·Application pending·0 cites
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