Inventor · disambiguated record
Lian-Cherng Chiang
Also filed as: CHIANG LIAN-CHERNG · CHIANG LIEN-CHEN
5 granted patents·171 citations·filing 1999–2003
83Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD5
Top patents by PatentIndex Score
5 records- 0187US6307257B1Dual-chip integrated circuit package with a chip-die pad formed from leadframe leadsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Oct 23, 2001·96 cites·15 claims
- 0278US6753206B2Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Jun 22, 2004·24 cites·1 claims
- 0360US6590279B1Dual-chip integrated circuit package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Jul 8, 2003·26 cites·10 claims
- 0457US6777266B2Dual-chip integrated circuit package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Aug 17, 2004·7 cites·6 claims
- 0554US6498391B1Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 1999·Granted Dec 24, 2002·18 cites·16 claims
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