Inventor · disambiguated record
Zhenguo Jiang
Also filed as: JIANG ZHENGUO
9 granted patents·4 pending applications·6 citations·filing 2018–2024
80Inventor score
Files withINTEL CORP13
Top patents by PatentIndex Score
13 records- 0193US11937367B2Radio frequency front-end structuresINTEL CORP·Filed 2023·Granted Mar 19, 2024·2 cites·20 claims
- 0288US11107757B2Integrated circuit structures in package substratesINTEL CORP·Filed 2020·Granted Aug 31, 2021·2 cites·20 claims
- 0381US12200855B2Radio frequency front-end structuresINTEL CORP·Filed 2024·Granted Jan 14, 2025·0 cites·20 claims
- 0481US10672693B2Integrated circuit structures in package substratesINTEL CORP·Filed 2018·Granted Jun 2, 2020·2 cites·21 claims
- 0580US2025071885A1Radio frequency front-end structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0671US11804426B2Integrated circuit structures in package substratesINTEL CORP·Filed 2021·Granted Oct 31, 2023·0 cites·12 claims
- 0758US11729902B2Radio frequency front-end structuresINTEL CORP·Filed 2019·Granted Aug 15, 2023·0 cites·20 claims
- 0857US2025194109A1Methods and architectures for hybrid solder and solderless die stackingINTEL CORP·Filed 2023·Application pending·0 cites
- 0950US2024105577A1Methods, systems, apparatus, and articles of manufacture to produce integrated circuit packages with grounding membersINTEL CORP·Filed 2022·Application pending·0 cites
- 1046US11611164B2Wideband multi-pin edge connector for radio frequency front end moduleINTEL CORP·Filed 2019·Granted Mar 21, 2023·0 cites·21 claims
- 1145US12003023B2In-package 3D antennaINTEL CORP·Filed 2019·Granted Jun 4, 2024·0 cites·10 claims
- 1244US2021305138A1Package land pad in closed-loop trace for high speed data signalingINTEL CORP·Filed 2020·Application pending·0 cites
- 1343US11482471B2Thermal management solutions for integrated circuit packagesINTEL CORP·Filed 2019·Granted Oct 25, 2022·0 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →