Inventor · disambiguated record
William J. Lambert
Also filed as: LAMBERT WILLIAM · LAMBERT WILLIAM J · LAMBERT WILLIAM JAMES
60 granted patents·24 pending applications·134 citations·filing 1982–2025
98Inventor score
Top patents by PatentIndex Score
84 records- 0196US10163557B2Helical plated through-hole package inductorINTEL CORP·Filed 2015·Granted Dec 25, 2018·6 cites·9 claims
- 0294US9230944B1Techniques and configurations associated with a capductor assemblyINTEL CORP·Filed 2014·Granted Jan 5, 2016·19 cites·24 claims
- 0393US11937367B2Radio frequency front-end structuresINTEL CORP·Filed 2023·Granted Mar 19, 2024·2 cites·20 claims
- 0493US11664596B2Antenna modules and communication devicesINTEL CORP·Filed 2021·Granted May 30, 2023·2 cites·20 claims
- 0593US10797394B2Antenna modules and communication devicesINTEL CORP·Filed 2018·Granted Oct 6, 2020·8 cites·25 claims
- 0692US12288750B2Conformal power delivery structure for direct chip attach architecturesINTEL CORP·Filed 2021·Granted Apr 29, 2025·2 cites·25 claims
- 0792US11380979B2Antenna modules and communication devicesINTEL IP CORP·Filed 2018·Granted Jul 5, 2022·8 cites·25 claims
- 0891US9515003B1Embedded air core inductors for integrated circuit package substrates with thermal conductorINTEL CORP·Filed 2015·Granted Dec 6, 2016·18 cites·20 claims
- 0989US12406962B2Power delivery through capacitor-dies in a multi-layered microelectronic assemblyINTEL CORP·Filed 2021·Granted Sep 2, 2025·2 cites·20 claims
- 1089US11335620B2Package inductor having thermal solution structuresINTEL CORP·Filed 2018·Granted May 17, 2022·8 cites·16 claims
- 1189US10998120B2Method of making an inductorINTEL CORP·Filed 2018·Granted May 4, 2021·1 cites·14 claims
- 1288US11355849B2Antenna package using ball attach array to connect antenna and base substratesINTEL CORP·Filed 2017·Granted Jun 7, 2022·4 cites·21 claims
- 1388US11107757B2Integrated circuit structures in package substratesINTEL CORP·Filed 2020·Granted Aug 31, 2021·2 cites·20 claims
- 1486US12347782B2Microelectronic assemblies with direct attach to circuit boardsINTEL CORP·Filed 2021·Granted Jul 1, 2025·1 cites·16 claims
- 1586US9753510B2Apparatus and method to reduce power losses in an integrated voltage regulatorINTEL CORP·Filed 2015·Granted Sep 5, 2017·5 cites·20 claims
- 1686US2025316887A1Antenna modules and communication devicesINTEL CORP·Filed 2025·Application pending·0 cites
- 1783US12255382B2Antenna modules and communication devicesINTEL CORP·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 1881US12200855B2Radio frequency front-end structuresINTEL CORP·Filed 2024·Granted Jan 14, 2025·0 cites·20 claims
- 1981US11121468B2Antenna modules and communication devicesINTEL CORP·Filed 2020·Granted Sep 14, 2021·1 cites·20 claims
- 2081US11112841B25G mmWave cooling through PCBINTEL CORP·Filed 2017·Granted Sep 7, 2021·3 cites·14 claims
- 2181US10672693B2Integrated circuit structures in package substratesINTEL CORP·Filed 2018·Granted Jun 2, 2020·2 cites·21 claims
- 2281US2025226583A1Antenna package using ball attach array to connect antenna and base substratesINTEL CORP·Filed 2025·Application pending·0 cites
- 2380US9911723B2Magnetic small footprint inductor array module for on-package voltage regulatorINTEL CORP·Filed 2015·Granted Mar 6, 2018·3 cites·11 claims
- 2480US9899311B2Hybrid pitch package with ultra high density interconnect capabilityINTEL CORP·Filed 2016·Granted Feb 20, 2018·2 cites·22 claims
- 2580US2025071885A1Radio frequency front-end structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 2679US9633938B2Hybrid pitch package with ultra high density interconnect capabilityINTEL CORP·Filed 2015·Granted Apr 25, 2017·2 cites·22 claims
- 2778US11608564B2Helical plated through-hole package inductorINTEL CORP·Filed 2021·Granted Mar 21, 2023·0 cites·13 claims
- 2877US10658765B2Edge-firing antenna walls built into substrateINTEL CORP·Filed 2018·Granted May 19, 2020·2 cites·32 claims
- 2976US11870163B2Antenna package using ball attach array to connect antenna and base substratesINTEL CORP·Filed 2022·Granted Jan 9, 2024·0 cites·25 claims
- 3076US11870132B2Antenna modules and communication devicesINTEL CORP·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 3176US2025022814A1Package embedded magnetic inductor structures and manufacturing techniques for 5-50 mhz smps operationsINTEL CORP·Filed 2024·Application pending·0 cites
- 3276US2025158269A1Antenna modules and communication devicesINTEL CORP·Filed 2025·Application pending·0 cites
- 3374US2025293170A1Microelectronic assemblies with direct attach to circuit boardsINTEL CORP·Filed 2025·Application pending·0 cites
- 3474US2024355725A1Power delivery structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 3573US11699630B2Thermals for packages with inductorsINTEL CORP·Filed 2022·Granted Jul 11, 2023·0 cites·20 claims
- 3673US2025118698A1Microelectronic assemblies including solder and non-solder interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 3772US12132015B2Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operationsINTEL CORP·Filed 2019·Granted Oct 29, 2024·1 cites·10 claims
- 3871US11804426B2Integrated circuit structures in package substratesINTEL CORP·Filed 2021·Granted Oct 31, 2023·0 cites·12 claims
- 3970US9397071B2High density interconnection of microelectronic devicesINTEL CORP·Filed 2013·Granted Jul 19, 2016·2 cites·12 claims
- 4069US12002745B2High performance integrated RF passives using dual lithography processINTEL CORP·Filed 2021·Granted Jun 4, 2024·0 cites·5 claims
- 4169US10503227B2Apparatus and method to reduce power losses in an integrated voltage regulatorINTEL CORP·Filed 2017·Granted Dec 10, 2019·1 cites·20 claims
- 4269US10340260B2Magnetic small footprint inductor array module for on-package voltage regulatorINTEL CORP·Filed 2018·Granted Jul 2, 2019·1 cites·8 claims
- 4369US9177831B2Die assembly on thin dielectric sheetCHIU CHIA-PIN·Filed 2013·Granted Nov 3, 2015·2 cites·15 claims
- 4466US11380652B2Multi-level distributed clampsINTEL CORP·Filed 2017·Granted Jul 5, 2022·1 cites·15 claims
- 4565US10157860B2Component stiffener architectures for microelectronic package structuresINTEL CORP·Filed 2016·Granted Dec 18, 2018·1 cites·23 claims
- 4663US12154710B2Package embedded magnetic power transformers for SMPSINTEL CORP·Filed 2020·Granted Nov 26, 2024·0 cites·8 claims
- 4762US12087682B2Power delivery structuresINTEL CORP·Filed 2020·Granted Sep 10, 2024·0 cites·25 claims
- 4861US2022256715A15G mmWAVE COOLING THROUGH PCBINTEL CORP·Filed 2021·Application pending·0 cites
- 4960US11676950B2Via-in-via structure for high density package integrated inductorINTEL CORP·Filed 2017·Granted Jun 13, 2023·0 cites·23 claims
- 5060US8243410B2Transient voltage compensation system and methodAYYANAR RAJAPANDIAN·Filed 2008·Granted Aug 14, 2012·6 cites·19 claims
Showing the top 50 of 84 patent records by PatentIndex Score.
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