Inventor · disambiguated record
Lee Teck Kheng
Also filed as: KHENG LEE T · KHENG LEE TECK
5 granted patents·1 pending application·81 citations·filing 2003–2020
76Inventor score
Top patents by PatentIndex Score
6 records- 0190US6913952B2Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packagesMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 5, 2005·76 cites·39 claims
- 0265US7572670B2Methods of forming semiconductor packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 11, 2009·3 cites·22 claims
- 0361US7262499B2Semiconductor packagesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 28, 2007·2 cites·3 claims
- 0449US11633236B2System and apparatus for guiding an instrumentINST OF TECHNICAL EDUCATION·Filed 2020·Granted Apr 25, 2023·0 cites·5 claims
- 0536US10835323B2System and apparatus for guiding an instrumentINST OF TECHNICAL EDUCATION·Filed 2013·Granted Nov 17, 2020·0 cites·38 claims
- 0636US2005230821A1Semiconductor packages, and methods of forming semiconductor packagesKHENG LEE T·Filed 2004·Application pending·0 cites
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