Inventor · disambiguated record
Jochen Kuhmann
Also filed as: KUHMANN JOCHEN · KUHMANN JOCHEN F · KUHMANN JOCHEN FRIEDRICH
17 granted patents·4 pending applications·573 citations·filing 2000–2018
93Inventor score
Top patents by PatentIndex Score
21 records- 0198US6522762B1Silicon-based sensor systemMICROTRONIC AS·Filed 2000·Granted Feb 18, 2003·250 cites·32 claims
- 0296US7221767B2Surface mountable transducer systemSONION MEMS AS·Filed 2002·Granted May 22, 2007·166 cites·16 claims
- 0394US7419853B2Method of fabrication for chip scale package for a micro componentHYMITE AS·Filed 2005·Granted Sep 2, 2008·37 cites·6 claims
- 0493US8103025B2Surface mountable transducer systemMULLENBORN MATTHIAS·Filed 2005·Granted Jan 24, 2012·47 cites·42 claims
- 0587US7447323B2Surface mountable transducer systemPULSE MEMS APS·Filed 2007·Granted Nov 4, 2008·14 cites·10 claims
- 0676US6832013B1Hybrid integration of active and passive optical components on an Si-boardHYMITE AS·Filed 2000·Granted Dec 14, 2004·25 cites·8 claims
- 0771US7253388B2Assembly with self-alignment features to position a cover on a substrate that supports a micro componentHYMITE AS·Filed 2004·Granted Aug 7, 2007·16 cites·17 claims
- 0868US7213978B2Optical device receiving substrate and optical device holding carrierHYMITE AS·Filed 2003·Granted May 8, 2007·15 cites·30 claims
- 0964US10913571B2Pallet having panels and tube segmentsAIR BAMBOO IND GMBH·Filed 2018·Granted Feb 9, 2021·1 cites·19 claims
- 1064US7851818B2Fabrication of compact opto-electronic component packagesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Dec 14, 2010·2 cites·5 claims
- 1147US2008315390A1Chip Scale Package For A Micro ComponentKUHMANN JOCHEN·Filed 2008·Application pending·0 cites
- 1244US11001411B2Pallet comprising folded wooden compositeAIR BAMBOO IND GMBH·Filed 2018·Granted May 11, 2021·0 cites·12 claims
- 1343US11707908B2Construction element having cover plates and tube segments made of a wood-based materialAIR BAMBOO IND GMBH·Filed 2017·Granted Jul 25, 2023·0 cites·13 claims
- 1443US8729591B2Opto-electronic device package with a semiconductor-based sub-mount having SMD metal contactsKUHMANN JOCHEN·Filed 2009·Granted May 20, 2014·0 cites·20 claims
- 1543US2007120041A1Sealed Package With Glass Window for Optoelectronic Components, and Assemblies Incorporating the SameSHIV LIOR·Filed 2006·Application pending·0 cites
- 1642US8852969B2Fabrication of compact opto-electronic component packagesKUHMANN JOCHEN·Filed 2010·Granted Oct 7, 2014·0 cites·20 claims
- 1739US2009181500A1Fabrication of Compact Semiconductor PackagesKUHMANN JOCHEN·Filed 2008·Application pending·0 cites
- 1837US10974866B2Pallet having panels and tube segmentsAIR BAMBOO IND GMBH·Filed 2017·Granted Apr 13, 2021·0 cites·23 claims
- 1936US2007292127A1Small form factor camera module with lens barrel and image sensorKUHMANN JOCHEN·Filed 2006·Application pending·0 cites
- 2035US12059876B2Web, sandwich plate, sandwich block and methods for producing sameAIR BAMBOO IND GMBH·Filed 2016·Granted Aug 13, 2024·0 cites·4 claims
- 2133US8309973B2Silicon-based sub-mount for an opto-electronic deviceKUHMANN JOCHEN·Filed 2009·Granted Nov 13, 2012·0 cites·18 claims
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