Inventor · disambiguated record
Wonsun Shin
Also filed as: SHIN WONSUN
6 granted patents·614 citations·filing 2000–2004
88Inventor score
Technology areasH10W
Files withAMKOR TECHNOLOGY INC6
Top patents by PatentIndex Score
6 records- 0198US6395578B1Semiconductor package and method for fabricating the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted May 28, 2002·346 cites·35 claims
- 0296US6762078B2Semiconductor package having semiconductor chip within central aperture of substrateAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 13, 2004·141 cites·15 claims
- 0389US6501184B1Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2000·Granted Dec 31, 2002·58 cites·22 claims
- 0485US7061120B2Stackable semiconductor package having semiconductor chip within central through hole of substrateAMKOR TECHNOLOGY INC·Filed 2004·Granted Jun 13, 2006·33 cites·7 claims
- 0575US6830955B2Semiconductor package and method for manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2002·Granted Dec 14, 2004·20 cites·12 claims
- 0666US6512288B1Circuit board semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 28, 2003·16 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →