Inventor · disambiguated record
Nicholas S. Haehn
Also filed as: HAEHN NICHOLAS · HAEHN NICHOLAS S · HAEHN NICHOLAS STEVEN
22 granted patents·26 pending applications·16 citations·filing 2015–2025
91Inventor score
Top patents by PatentIndex Score
48 records- 0194US12261150B2Mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2023·Granted Mar 25, 2025·1 cites·20 claims
- 0294US12087731B2No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2023·Granted Sep 10, 2024·1 cites·18 claims
- 0386US10553548B2Methods of forming multi-chip package structuresINTEL CORP·Filed 2017·Granted Feb 4, 2020·6 cites·8 claims
- 0479US11901333B2No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2019·Granted Feb 13, 2024·1 cites·25 claims
- 0578US2025192101A1No mold shelf package design and process flow for advanced package architecturesINTEL CORP·Filed 2025·Application pending·0 cites
- 0677US12362250B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2024·Granted Jul 15, 2025·0 cites·19 claims
- 0777US12068222B2Dummy die structures of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Granted Aug 20, 2024·1 cites·15 claims
- 0877US2025273599A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2025·Application pending·0 cites
- 0976US12009271B2Protruding SN substrate features for epoxy flow controlINTEL CORP·Filed 2019·Granted Jun 11, 2024·2 cites·26 claims
- 1075US12334453B2Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1174US11640929B2Thermal management solutions for cored substratesINTEL CORP·Filed 2018·Granted May 2, 2023·2 cites·20 claims
- 1266US10576590B2Torque controlled driver apparatus and methodINTEL CORP·Filed 2016·Granted Mar 3, 2020·2 cites·5 claims
- 1364US11528811B2Method, device and system for providing etched metallization structuresINTEL CORP·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 1461US2024355758A1Methods and apparatus to reduce stress between sockets and associated integrated circuit packages having glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1559US2025132264A1Glass cores with embedded power delivery componentsINTEL CORP·Filed 2024·Application pending·0 cites
- 1659US2025149455A1Integrated circuit packages including glass-cored substrates with self-aligned through glass viasINTEL CORP·Filed 2023·Application pending·0 cites
- 1758US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 1857US12400363B2Device and method for improved fiducial marker detectionINTEL CORP·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 1955US11942393B2Substrate with thermal insulationINTEL CORP·Filed 2020·Granted Mar 26, 2024·0 cites·16 claims
- 2055US10515824B2Enhanced etch anisotropy using nanoparticles as banking agents in the presence or absence of a magnetic or electrical fieldINTEL CORP·Filed 2018·Granted Dec 24, 2019·0 cites·24 claims
- 2155US2025113434A1Through glass via (tgv) with modulated profile for core stress reductionINTEL CORP·Filed 2023·Application pending·0 cites
- 2255US2025112164A1Controlling substrate bump heightINTEL CORP·Filed 2023·Application pending·0 cites
- 2354US2021035921A1Soldered metallic reservoirs for enhanced transient and steady-state thermal performanceINTEL CORP·Filed 2019·Application pending·0 cites
- 2453US2025106982A1Nanotwin liner for through glass viasINTEL CORP·Filed 2023·Application pending·0 cites
- 2553US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 2652US2025112163A1Through-glass via liners for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 2751US11832419B2Full package vapor chamber with IHSINTEL CORP·Filed 2019·Granted Nov 28, 2023·0 cites·26 claims
- 2851US2025112175A1Microelectronic assemblies with edge stress reduction in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2951US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 3050US11116084B2Method, device and system for providing etched metallization structuresINTEL CORP·Filed 2017·Granted Sep 7, 2021·0 cites·20 claims
- 3150US2025112140A1Stress mitigation architectures for glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 3249US11594463B2Substrate thermal layer for heat spreader connectionINTEL CORP·Filed 2018·Granted Feb 28, 2023·0 cites·17 claims
- 3349US2024186197A1Substrate architecture for enhanced electrostatic chuckingINTEL CORP·Filed 2022·Application pending·0 cites
- 3449US2022384306A1Thermal interface structure for integrated circuit device assembliesINTEL CORP·Filed 2021·Application pending·0 cites
- 3549US2024070366A1Adaptive trace width in multi-layer substrate packageINTEL CORP·Filed 2022·Application pending·0 cites
- 3647US11776864B2Corner guard for improved electroplated first level interconnect bump height rangeINTEL CORP·Filed 2019·Granted Oct 3, 2023·0 cites·25 claims
- 3746US10428439B2Predictive capability for electroplating shield designINTEL CORP·Filed 2015·Granted Oct 1, 2019·0 cites·12 claims
- 3845US2021249330A1Composite thermal matrixINTEL CORP·Filed 2020·Application pending·0 cites
- 3945US2023086180A1Deformable semiconductor device connectionINTEL CORP·Filed 2021·Application pending·0 cites
- 4044US2023086649A1Semiconductor Chip Package Having Internal I/O Structures With Modulated Thickness To Compensate For Die/Substrate WarpageINTEL CORP·Filed 2021·Application pending·0 cites
- 4144US2024079530A1Ic package with micro ledsINTEL CORP·Filed 2022·Application pending·0 cites
- 4243US11502008B2Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage controlINTEL CORP·Filed 2017·Granted Nov 15, 2022·0 cites·13 claims
- 4343US10438812B2Anisotropic etching systems and methods using a photochemically enhanced etchantINTEL CORP·Filed 2017·Granted Oct 8, 2019·0 cites·13 claims
- 4443US2024215163A1Substrate glass core patterning for ctv improvement and layer count reductionINTEL CORP·Filed 2022·Application pending·0 cites
- 4543US2022102231A1Dummy die in a recessed mold structure of a packaged integrated circuit deviceINTEL CORP·Filed 2020·Application pending·0 cites
- 4642US11652036B2Via-trace structuresINTEL CORP·Filed 2018·Granted May 16, 2023·0 cites·19 claims
- 4742US2024079259A1Dual sided glass carriers for making package substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 4841US2021066162A1Semiconductor package with attachment and/or stop structuresINTEL CORP·Filed 2019·Application pending·0 cites
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