Inventor · disambiguated record
Dennis Zegzula
Also filed as: ZEGZULA DENNIS
6 granted patents·1 pending application·17 citations·filing 2014–2020
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0178US9392713B2Low cost high strength surface mount packageRSM ELECTRON POWER INC·Filed 2014·Granted Jul 12, 2016·5 cites·20 claims
- 0260US10879211B2Method of joining a surface-mount component to a substrate with solder that has been temporarily securedR S M ELECTRON POWER INC·Filed 2016·Granted Dec 29, 2020·1 cites·17 claims
- 0353US2021082868A1Method of joining a surface-mount component to a substrate with solder that has been temporarily securedR S M ELECTRON POWER INC·Filed 2020·Application pending·0 cites
- 0448USD803798SSurface mount deviceRSM ELECTRON POWER INC·Filed 2016·Granted Nov 28, 2017·5 cites·1 claims
- 0544USD803796SSurface mount deviceRSM ELECTRON POWER INC·Filed 2016·Granted Nov 28, 2017·4 cites·1 claims
- 0632USD803797SSurface mount deviceRSM ELECTRON POWER INC·Filed 2016·Granted Nov 28, 2017·1 cites·1 claims
- 0732USD803795SSurface mount deviceRSM ELECTRON POWER INC·Filed 2016·Granted Nov 28, 2017·1 cites·1 claims
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