Inventor · disambiguated record
Seong Min Son
Also filed as: SON SEONG-MIN
18 granted patents·6 pending applications·40 citations·filing 2013–2025
91Inventor score
Files withHYUNDAI MOTOR CO LTD10SAMSUNG ELECTRONICS CO LTD10JUNG DEOK-YOUNG2MAGNA ELECTRONICS SWEDEN AB1POSCO CO LTD1
Top patents by PatentIndex Score
24 records- 0195US11754172B2Powertrain-cooling system of hybrid vehicleHYUNDAI MOTOR CO LTD·Filed 2021·Granted Sep 12, 2023·6 cites·15 claims
- 0291US8963336B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameJUNG DEOK-YOUNG·Filed 2014·Granted Feb 24, 2015·12 cites·20 claims
- 0386US11168785B1Hydraulic pressure control method for transmissionHYUNDAI MOTOR CO LTD·Filed 2020·Granted Nov 9, 2021·2 cites·16 claims
- 0486US9064941B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameJUNG DEOK-YOUNG·Filed 2015·Granted Jun 23, 2015·5 cites·11 claims
- 0583US10833032B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 10, 2020·3 cites·20 claims
- 0682US11469202B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·1 cites·20 claims
- 0782US10580726B2Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 3, 2020·3 cites·20 claims
- 0877US9496218B2Integrated circuit device having through-silicon-via structureSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 15, 2016·4 cites·30 claims
- 0973US9006902B2Semiconductor devices having through silicon vias and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 14, 2015·3 cites·18 claims
- 1071US11798906B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·19 claims
- 1171US10483224B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 19, 2019·1 cites·20 claims
- 1268US11614162B2Method of controlling an electric oil pump of a vehicleHYUNDAI MOTOR CO LTD·Filed 2022·Granted Mar 28, 2023·0 cites·7 claims
- 1367US11946541B2Method of controlling EOP of powertrain of vehicleHYUNDAI MOTOR CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·17 claims
- 1465US12007018B2Hydraulic pressure control method for a vehicle transmissionHYUNDAI MOTOR CO LTD·Filed 2022·Granted Jun 11, 2024·0 cites·9 claims
- 1564US11578796B2Method for controlling EOP of hybrid vehicleHYUNDAI MOTOR CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·11 claims
- 1662US2025333096A1Steering control angle compensation method for lane keeping and lane keeping control deviceMAGNA ELECTRONICS SWEDEN AB·Filed 2025·Application pending·0 cites
- 1761US11251144B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 15, 2022·0 cites·23 claims
- 1859US11643952B2Method of controlling electric oil pump for vehicleHYUNDAI MOTOR CO LTD·Filed 2022·Granted May 9, 2023·0 cites·20 claims
- 1958US11603919B2Method of controlling EOP of hybrid vehicleHYUNDAI MOTOR CO LTD·Filed 2021·Granted Mar 14, 2023·0 cites·19 claims
- 2054US2024139669A1Method for preparing hydrogen from ammonia by using pressure swing adsorptionPOSCO CO LTD·Filed 2022·Application pending·0 cites
- 2151US2022307526A1Hybrid vehicle control methodHYUNDAI MOTOR CO LTD·Filed 2021·Application pending·0 cites
- 2248US2023407872A1System for operating oil pump for mobility vehicleHYUNDAI MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 2343US2014138819A1Semiconductor device including tsv and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2435US2016163590A1Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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