Inventor · disambiguated record
Ji-Soon Park
Also filed as: PARK JI-SOON
26 granted patents·12 pending applications·115 citations·filing 1996–2018
95Inventor score
Top patents by PatentIndex Score
38 records- 0192US8155311B2Method and apparatus for encrypting message for maintaining message integrity, and method and apparatus for decrypting message for maintaining message integritySHIN JUN-BUM·Filed 2007·Granted Apr 10, 2012·37 cites·21 claims
- 0291US8963336B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameJUNG DEOK-YOUNG·Filed 2014·Granted Feb 24, 2015·12 cites·20 claims
- 0389US9735090B2Integrated circuit devices having through-silicon vias and methods of manufacturing such devicesCHOI JU-IL·Filed 2015·Granted Aug 15, 2017·10 cites·20 claims
- 0487US8547747B2Non-volatile memory deviceKIM SU-KYOUNG·Filed 2011·Granted Oct 1, 2013·12 cites·19 claims
- 0586US9691685B2Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 27, 2017·4 cites·20 claims
- 0686US9064941B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameJUNG DEOK-YOUNG·Filed 2015·Granted Jun 23, 2015·5 cites·11 claims
- 0779US10128168B2Integrated circuit device including through-silicon via structure and method of manufacturing the sameCHOI JU IL·Filed 2014·Granted Nov 13, 2018·4 cites·17 claims
- 0879US8476763B2Semiconductor device conductive pattern structures including dummy conductive patternsKIM HEI-SEUNG·Filed 2011·Granted Jul 2, 2013·5 cites·8 claims
- 0971US10777487B2Integrated circuit device including through-silicon via structure and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 15, 2020·1 cites·20 claims
- 1064US8932964B2Method of forming a dielectric layer having an ONO structure using an in-situ processLEE WOO-JIN·Filed 2012·Granted Jan 13, 2015·1 cites·16 claims
- 1161US7199019B2Method for forming tungsten contact plugSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Apr 3, 2007·7 cites·33 claims
- 1256US9773114B2Method for analysing program code of electronic device and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 26, 2017·1 cites·17 claims
- 1355US9027145B2Method and apparatus for detecting leak of information resource of deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 5, 2015·1 cites·17 claims
- 1452US7311109B2Method for cleaning a processing chamber and method for manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 25, 2007·3 cites·16 claims
- 1551US8806212B2Method and apparatus for generating and verifying electronic signature of software data, and computer readable recording medium thereofSHIN JUN-BUM·Filed 2008·Granted Aug 12, 2014·0 cites·8 claims
- 1650US10917734B2Electronic device for controlling speaker and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 9, 2021·0 cites·17 claims
- 1750US9431341B2Semiconductor device having metal patterns and piezoelectric patternsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 30, 2016·0 cites·20 claims
- 1847US8709937B2Method of forming micropattern, method of forming damascene metallization, and semiconductor device and semiconductor memory device fabricated using the samePARK IN-SUN·Filed 2012·Granted Apr 29, 2014·0 cites·22 claims
- 1947US2014210055A1Method of forming micropattern, method of forming damascene metallization, and semiconductor device and semiconductor memory device fabricated using the samePARK IN-SUN·Filed 2014·Application pending·0 cites
- 2047US2010106771A1Method and apparatus for communication based on certification using static and dynamic identifierSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2147US2006145269A1Semiconductor device having a capping layer including cobalt and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2246US6797618B2Method for forming silicide film of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Sep 28, 2004·1 cites·14 claims
- 2346US2008279385A1Method and host device for using content using mobile card, and mobile cardSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2446US2009055645A1Method and apparatus for checking round trip time based on challenge response, and computer readable medium having recorded thereon program for the methodSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2544US5834847ACompletely buried contact holesSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Nov 10, 1998·9 cites·22 claims
- 2642US10762242B2Electronic apparatus and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 1, 2020·0 cites·13 claims
- 2742US7037828B2Semiconductor device having a capping layer including cobalt and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 2, 2006·0 cites·12 claims
- 2842US2014145327A1Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2941US2017051424A1Shielding Unit and Plating Apparatus Including the SameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 3039US9100677B2Server, client device, method for generating a transport stream thereof and processing the transport stream thereofKANG DONG-JIN·Filed 2012·Granted Aug 4, 2015·0 cites·16 claims
- 3139US8592979B2Semiconductor device conductive pattern structures and methods of manufacturing the sameKIM HEI-SEUNG·Filed 2012·Granted Nov 26, 2013·0 cites·14 claims
- 3239US2015121348A1Method and device for analyzing applicationSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 3339US2010258486A1Apparatus for prevention of mud hardening in drain holding tankSAMSUNG HEAVY IND·Filed 2010·Application pending·0 cites
- 3439US2006281289A1Method of forming polycide layer and method of manufacturing semiconductor device having polycide layerSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3535US2016163590A1Methods of manufacturing semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 3635US2001018273A1Method of fabricating copper interconnecting lineSAMSUNG ELECTRONICS CO LTD·Filed 2000·Application pending·0 cites
- 3732US5982039ACompletely buried contact holesSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Nov 9, 1999·2 cites·10 claims
- 3829US5950105ACompletely buried contact holes and methods of forming sameSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Sep 7, 1999·0 cites·12 claims
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