Inventor
SWEIS JASON
US13 patents
⚠️ This page may combine multiple inventors who share the name “SWEIS JASON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TESSERA INC
6 patentsUS6054756AApr 25, 2000
Connection components with frangible leads and bus
TESSERA INC229 citations98
US5477611ADec 26, 1995
Method of forming interface between die and chip carrier
TESSERA INC164 citations98
US5398863AMar 21, 1995
Shaped lead structure and method
TESSERA INC171 citations97
US5390844AFeb 21, 1995
Semiconductor inner lead bonding tool
TESSERA INC144 citations97
US5915752AJun 29, 1999
Method of making connections to a semiconductor chip assembly
TESSERA INC89 citations96
US6888229B2May 3, 2005
Connection components with frangible leads and bus
TESSERA INC2 citations62
SWEIS JASON
4 patentsUS8997026B1Mar 31, 2015
System and method for self alignment of pad mask
SWEIS JASON11 citations82
US8438506B2May 7, 2013
Method and system for implementing controlled breaks between features using sub-resolution assist features
SWEIS JASON1 citations61
US8103985B2Jan 24, 2012
Method and system for implementing controlled breaks between features using sub-resolution assist features
SWEIS JASON3 citations61
US8429572B2Apr 23, 2013
Method and system for implementing controlled breaks between features using sub-resolution assist features
SWEIS JASON0 citations50