P

Inventor

CHANG KENNY

TW10 patents
⚠️ This page may combine multiple inventors who share the name “CHANG KENNY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VIA TECH INC

5 patents
US6680544B2Jan 20, 2004

Flip-chip bump arrangement for decreasing impedance

VIA TECH INC142 citations95
US7038309B2May 2, 2006

Chip package structure with glass substrate

VIA TECH INC28 citations92
US7145234B2Dec 5, 2006

Circuit carrier and package structure thereof

VIA TECH INC5 citations62
US6909187B2Jun 21, 2005

Conductive wiring layer structure

VIA TECH INC4 citations60
US6965169B2Nov 15, 2005

Hybrid integrated circuit package substrate

VIA TECH INC4 citations57

CHANG KENNY

4 patents
USD382115SAug 12, 1997

Tool box

CHANG KENNY53 citations94
USD367557SMar 5, 1996

Tool box

CHANG KENNY37 citations90
US8133532B2Mar 13, 2012

Method of densifying porous articles

CHANG KENNY7 citations77
US8569188B2Oct 29, 2013

One piece shim

CHANG KENNY0 citations50

DELECROIX VINCENT

1 patent
US8931148B2Jan 13, 2015

Method of making a three-dimensional fiber preform for fabricating an annular part out of carbon/carbon composite material

DELECROIX VINCENT0 citations32