Inventor · disambiguated record
Minjun Bae
Also filed as: BAE MINJUN
9 granted patents·6 pending applications·9 citations·filing 2019–2025
81Inventor score
Top patents by PatentIndex Score
15 records- 0189US10950539B2Redistribution substrate, method of fabricating the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·5 cites·21 claims
- 0287US11894338B2Wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 6, 2024·1 cites·18 claims
- 0387US11264354B2Wafer level packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 1, 2022·2 cites·20 claims
- 0486US2025054992A1Black metallic nanorod arrays and method of manufacturing thereofUNIV WAYNE STATE·Filed 2024·Application pending·0 cites
- 0584US11948872B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·1 cites·20 claims
- 0679US12230556B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 18, 2025·0 cites·16 claims
- 0776US12160005B2Black metallic nanorod arrays and method of manufacturing thereofUNIV WAYNE STATE·Filed 2021·Granted Dec 3, 2024·0 cites·20 claims
- 0876US11973028B2Redistribution substrate, method of fabricating the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 30, 2024·0 cites·20 claims
- 0973US2024312886A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1069US2025149418A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1168US11600564B2Redistribution substrate, method of fabricating the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·19 claims
- 1263US12014975B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 1357US2024128155A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1451US2022415835A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1545US2021020505A1Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →