Inventor · disambiguated record
Hidekazu Otomaru
Also filed as: OTOMARU HIDEKAZU
13 granted patents·3 pending applications·122 citations·filing 2003–2018
91Inventor score
Top patents by PatentIndex Score
16 records- 0195US9418778B2Method of manufacturing a feedthroughKYOCERA CORP·Filed 2014·Granted Aug 16, 2016·17 cites·15 claims
- 0288US8588916B2Feedthrough configured for interconnectMORIOKA KENGO·Filed 2011·Granted Nov 19, 2013·13 cites·27 claims
- 0386US10471266B2Hermetic feedthrough for an implantable medical deviceMEDTRONIC INC·Filed 2016·Granted Nov 12, 2019·2 cites·20 claims
- 0484US10338019B2Sensor substrate and sensor deviceKYOCERA CORP·Filed 2016·Granted Jul 2, 2019·2 cites·14 claims
- 0584US9008779B2Insulator for a feedthroughKYOCERA CORP·Filed 2014·Granted Apr 14, 2015·21 cites·23 claims
- 0684US8841558B2Hermetic feedthroughMORIOKA KENGO·Filed 2011·Granted Sep 23, 2014·26 cites·38 claims
- 0784US8670829B2Insulator for a feedthroughMORIOKA KENGO·Filed 2011·Granted Mar 11, 2014·20 cites·22 claims
- 0882US10408776B2Sensor board, lead-bearing sensor board, and sensor deviceKYOCERA CORP·Filed 2015·Granted Sep 10, 2019·2 cites·8 claims
- 0979US8872035B2Hermetic feedthroughMORIOKA KENGO·Filed 2012·Granted Oct 28, 2014·15 cites·38 claims
- 1075US8481222B2Fuel cell and electronic device including the fuel cellOTOMARU HIDEKAZU·Filed 2006·Granted Jul 9, 2013·4 cites·19 claims
- 1151US11513095B2Sensor board and sensor deviceKYOCERA CORP·Filed 2018·Granted Nov 29, 2022·0 cites·5 claims
- 1249US10768131B2Sensor substrate arrangement for a particulate sensor deviceKYOCERA CORP·Filed 2016·Granted Sep 8, 2020·0 cites·15 claims
- 1349US9414486B2Wiring board, wiring board with lead, and electronic deviceKYOCERA CORP·Filed 2014·Granted Aug 9, 2016·0 cites·15 claims
- 1446US2020182768A1Sensor board and sensor device including sensor boardKYOCERA CORP·Filed 2018·Application pending·0 cites
- 1541US2004146772A1Fuel cell casing, fuel cell and electronic apparatusKYOCERA CORP·Filed 2003·Application pending·0 cites
- 1639US2021134687A1Electronic component mounting package and electronic deviceKYOCERA CORP·Filed 2018·Application pending·0 cites
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