Inventor · disambiguated record
Yangyin Chen
Also filed as: CHEN YANGYIN
23 granted patents·266 citations·filing 2016–2021
95Inventor score
Top patents by PatentIndex Score
23 records- 0199US10038092B1Three-level ferroelectric memory cell using band alignment engineeringSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Jul 31, 2018·53 cites·12 claims
- 0298US11348901B1Interfacial tilt-resistant bonded assembly and methods for forming the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted May 31, 2022·8 cites·20 claims
- 0398US9941299B1Three-dimensional ferroelectric memory device and method of making thereofSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Apr 10, 2018·99 cites·19 claims
- 0497US10559588B2Three-dimensional flat inverse NAND memory device and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Feb 11, 2020·19 cites·20 claims
- 0597US9735202B1Implementation of VMCO area switching cell to VBL architectureSANDISK TECHNOLOGIES INC·Filed 2016·Granted Aug 15, 2017·22 cites·18 claims
- 0695US11869877B2Bonded assembly including inter-die via structures and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Jan 9, 2024·3 cites·19 claims
- 0795US9768180B1Methods and apparatus for three-dimensional nonvolatile memorySANDISK TECHNOLOGIES LLC·Filed 2016·Granted Sep 19, 2017·16 cites·20 claims
- 0895US9754665B2Vacancy-modulated conductive oxide resistive RAM device including an interfacial oxygen source layerSANDISK TECHNOLOGIES LLC·Filed 2016·Granted Sep 5, 2017·18 cites·18 claims
- 0994US11424215B2Bonded assembly formed by hybrid wafer bonding using selectively deposited metal linersSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Aug 23, 2022·3 cites·19 claims
- 1091US11094653B2Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Aug 17, 2021·8 cites·19 claims
- 1190US11037908B2Bonded die assembly containing partially filled through-substrate via structures and methods for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Jun 15, 2021·7 cites·15 claims
- 1284US10453861B1Ferroelectric non-volatile memorySANDISK TECHNOLOGIES LLC·Filed 2018·Granted Oct 22, 2019·3 cites·8 claims
- 1383US10109679B2Wordline sidewall recess for integrating planar selector deviceSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Oct 23, 2018·3 cites·19 claims
- 1475US10734408B2Ferroelectric non-volatile memorySANDISK TECHNOLOGIES LLC·Filed 2019·Granted Aug 4, 2020·1 cites·13 claims
- 1570US11239204B2Bonded assembly containing laterally bonded bonding pads and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Feb 1, 2022·1 cites·20 claims
- 1670US10461095B2Ferroelectric non-volatile memorySANDISK TECHNOLOGIES LLC·Filed 2018·Granted Oct 29, 2019·1 cites·10 claims
- 1761US10453862B1Ferroelectric non-volatile memorySANDISK TECHNOLOGIES LLC·Filed 2018·Granted Oct 22, 2019·1 cites·7 claims
- 1856US10026782B2Implementation of VMCO area switching cell to VBL architectureSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Jul 17, 2018·0 cites·18 claims
- 1955US12347804B2Bonded assembly including interconnect-level bonding pads and methods of forming the sameSANDISK TECHNOLOGIES LLC·Filed 2021·Granted Jul 1, 2025·0 cites·20 claims
- 2048US11430745B2Semiconductor die containing silicon nitride stress compensating regions and method for making the sameSANDISK TECHNOLOGIES LLC·Filed 2020·Granted Aug 30, 2022·0 cites·7 claims
- 2148US11276705B2Embedded bonded assembly and method for making the sameSANDISK TECHNOLOGIES LLC·Filed 2019·Granted Mar 15, 2022·0 cites·10 claims
- 2247US9941331B1Device with sub-minimum pitch and method of makingSANDISK TECHNOLOGIES LLC·Filed 2017·Granted Apr 10, 2018·0 cites·18 claims
- 2346US10756186B2Three-dimensional memory device including germanium-containing vertical channels and method of making the sameSANDISK TECHNOLOGIES LLC·Filed 2018·Granted Aug 25, 2020·0 cites·10 claims
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