Inventor · disambiguated record
Charavana K. Gurumurthy
Also filed as: GURUMURTHY CHARAVANA · GURUMURTHY CHARAVANA K
9 granted patents·1 pending application·28 citations·filing 2005–2016
83Inventor score
Top patents by PatentIndex Score
10 records- 0183US8278214B2Through mold via polymer block packageROY MIHIR K·Filed 2009·Granted Oct 2, 2012·10 cites·8 claims
- 0280US7538429B2Method of enabling solder deposition on a substrate and electronic package formed therebyINTEL CORP·Filed 2006·Granted May 26, 2009·8 cites·11 claims
- 0370US7825022B2Method of enabling solder deposition on a substrate and electronic package formed therebyINTEL CORP·Filed 2009·Granted Nov 2, 2010·4 cites·13 claims
- 0467US7432202B2Method of substrate manufacture that decreases the package resistanceINTEL CORP·Filed 2005·Granted Oct 7, 2008·4 cites·13 claims
- 0560US9299602B2Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) packageZHANG QINGLEI·Filed 2011·Granted Mar 29, 2016·2 cites·25 claims
- 0652US9691727B2Pad-less interconnect for electrical coreless substrateINTEL CORP·Filed 2015·Granted Jun 27, 2017·0 cites·19 claims
- 0751US8450857B2Through mold via polymer block packageROY MIHIR K·Filed 2012·Granted May 28, 2013·0 cites·7 claims
- 0846US10103037B2Flexible microelectronic systems and methods of fabricating the sameINTEL CORP·Filed 2014·Granted Oct 16, 2018·0 cites·16 claims
- 0943US2008003804A1Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stagesNALLA RAVI·Filed 2006·Application pending·0 cites
- 1042US10317952B2Compartment for magnet placementINTEL CORP·Filed 2016·Granted Jun 11, 2019·0 cites·16 claims
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