Inventor · disambiguated record
Xinpei Cao
Also filed as: CAO XINPEI
4 granted patents·1 pending application·5 citations·filing 2013–2023
59Inventor score
Top patents by PatentIndex Score
5 records- 0174US8974705B2Sinterable silver flake adhesive for use in electronicsHENKEL AG & CO KGAA·Filed 2013·Granted Mar 10, 2015·5 cites·13 claims
- 0268US2024076488A1Electrically conductive compositions capable of sinteringHENKEL AG & CO KGAA·Filed 2023·Application pending·0 cites
- 0342US10985108B2Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereofHenkel IP & Holding GmbH·Filed 2018·Granted Apr 20, 2021·0 cites·20 claims
- 0442US10741503B2Graphene-containing materials for coating and gap filling applicationsHenkel IP & Holding GmbH·Filed 2019·Granted Aug 11, 2020·0 cites·20 claims
- 0528US10858523B2Achieving electromagnetic interference shielding protection by deposition of highly conductive compositionsHenkel IP & Holding GmbH·Filed 2018·Granted Dec 8, 2020·0 cites·21 claims
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