Inventor · disambiguated record
Akira Karashima
Also filed as: KARASHIMA AKIRA
7 granted patents·1 pending application·236 citations·filing 1987–2005
88Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC7
Top patents by PatentIndex Score
8 records- 0191US6780749B2Method of manufacturing a semiconductor chip comprising multiple bonding pads in staggard rows on edgesTEXAS INSTRUMENTS INC·Filed 2003·Granted Aug 24, 2004·63 cites·16 claims
- 0280US6873059B2Semiconductor package with metal foil attachment filmTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 29, 2005·25 cites·16 claims
- 0380US5920116ARigidized lead frame for a semiconductor deviceTEXAS INSTRUMENTS INC·Filed 1996·Granted Jul 6, 1999·61 cites·16 claims
- 0473US6583483B2Semiconductor device and its manufacturing methodTEXAS INSTRUMENTS INC·Filed 2001·Granted Jun 24, 2003·18 cites·18 claims
- 0572US4870474ALead frameTEXAS INSTRUMENTS INC·Filed 1987·Granted Sep 26, 1989·44 cites·4 claims
- 0659US6768212B2Semiconductor packages and methods for manufacturing such semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2003·Granted Jul 27, 2004·10 cites·10 claims
- 0745US6225703B1Semiconductor deviceTEXAS INSTRUMENTS INC·Filed 1999·Granted May 1, 2001·15 cites·20 claims
- 0844US2005127498A1Copper-based chip attach for chip-scale semiconductor packagesFiled 2005·Application pending·0 cites
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