Inventor · disambiguated record
Suguru Tabara
Also filed as: TABARA SUGURU
26 granted patents·428 citations·filing 1993–2003
97Inventor score
Top patents by PatentIndex Score
26 records- 0180US5707883AMethod for manufacturing a semiconductor device using antireflection coatingYAMAHA CORP·Filed 1995·Granted Jan 13, 1998·53 cites·6 claims
- 0271US5910021AManufacture of semiconductor device with fine pattensYAMAHA CORP·Filed 1997·Granted Jun 8, 1999·31 cites·6 claims
- 0365US6137175ASemiconductor device with multi-layer wiringYAMAHA CORP·Filed 1999·Granted Oct 24, 2000·23 cites·8 claims
- 0465US5767015AMetal plug with adhesion layerYAMAHA CORP·Filed 1996·Granted Jun 16, 1998·31 cites·13 claims
- 0563US6187689B1Manufacture of semiconductor device with fine patternsYAMAHA CORP·Filed 1998·Granted Feb 13, 2001·21 cites·6 claims
- 0661US5998300AMethod of manufacturing a semiconductor device using antireflection coatingYAMAHA CORP·Filed 1997·Granted Dec 7, 1999·22 cites·13 claims
- 0756US6348404B1Wiring forming methodYAMAHA CORP·Filed 1998·Granted Feb 19, 2002·17 cites·8 claims
- 0856US6114182AMeasurement of electron shading damageYAMAHA CORP·Filed 1999·Granted Sep 5, 2000·21 cites·12 claims
- 0956US5514621AMethod of etching polysilicon using a thin oxide mask formed on the polysilicon while dopingYAMAHA CORP·Filed 1993·Granted May 7, 1996·16 cites·16 claims
- 1055US6080681AMethod of forming wiring patternYAMAHA CORP·Filed 1999·Granted Jun 27, 2000·19 cites·39 claims
- 1153US6008132ADry etching suppressing formation of notchYAMAHA CORP·Filed 1996·Granted Dec 28, 1999·18 cites·10 claims
- 1253US5940682AMethod of measuring electron shading damageYAMAHA CORP·Filed 1997·Granted Aug 17, 1999·18 cites·11 claims
- 1353US5399527AMethod of forming multilayer aluminum wiring in semiconductor ICYAMAHA CORP·Filed 1993·Granted Mar 21, 1995·18 cites·24 claims
- 1452US5519254AMultilayer aluminum wiring in semiconductor ICYAMAHA CORP·Filed 1994·Granted May 21, 1996·17 cites·41 claims
- 1551US5451293AMethod of making a wiring layer wherein the masking material is ashed using an alcohol containing plasmaYAMAHA CORP·Filed 1993·Granted Sep 19, 1995·20 cites·36 claims
- 1650US6509261B2Wiring forming methodYAMAHA CORP·Filed 2001·Granted Jan 21, 2003·2 cites·4 claims
- 1749US6147003AMethod of manufacturing semiconductor deviceYAMAHA CORP·Filed 1998·Granted Nov 14, 2000·14 cites·17 claims
- 1848US5786637AInterconnection with metal plug and reduced stepYAMAHA CORP·Filed 1997·Granted Jul 28, 1998·12 cites·5 claims
- 1948US5639341ADry etching with less particlesYAMAHA CORP·Filed 1996·Granted Jun 17, 1997·13 cites·26 claims
- 2046US5904490AMethod of measuring electron shading damageYAMAHA CORP·Filed 1997·Granted May 18, 1999·12 cites·10 claims
- 2144US6150250AConductive layer forming method using etching mask with direction <200>YAMAHA CORP·Filed 1998·Granted Nov 21, 2000·11 cites·19 claims
- 2242US6835651B2Wiring forming methodYAMAHA CORP·Filed 2002·Granted Dec 28, 2004·0 cites·22 claims
- 2337US6197689B1Semiconductor manufacture method with aluminum wiring layer patterning processYAMAHA CORP·Filed 1997·Granted Mar 6, 2001·6 cites·11 claims
- 2437US5686363AControlled taper etchingYAMAHA CORP·Filed 1993·Granted Nov 11, 1997·8 cites·20 claims
- 2537US5670422AMethod of forming an interconnection with metal plug and reduced stepYAMAHA CORP·Filed 1996·Granted Sep 23, 1997·5 cites·15 claims
- 2636US7265058B2Method of manufacturing semiconductor deviceROHM CO LTD·Filed 2003·Granted Sep 4, 2007·0 cites·8 claims
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