Inventor · disambiguated record
David N. Light
Also filed as: LIGHT DAVID N · LIGHT DAVID NOEL
29 granted patents·3 pending applications·1,020 citations·filing 1982–2021
97Inventor score
Top patents by PatentIndex Score
32 records- 0194US5574630ALaminated electronic package including a power/ground assemblyIBM·Filed 1995·Granted Nov 12, 1996·189 cites·12 claims
- 0294US5185073AMethod of fabricating nendritic materialsIBM·Filed 1991·Granted Feb 9, 1993·173 cites·4 claims
- 0392US8641428B2Electrical connector and method of making itLIGHT DAVID NOEL·Filed 2011·Granted Feb 4, 2014·25 cites·23 claims
- 0491US5384690AFlex laminate package for a parallel processorIBM·Filed 1993·Granted Jan 24, 1995·61 cites·11 claims
- 0591US5137461ASeparable electrical connection technologyIBM·Filed 1990·Granted Aug 11, 1992·134 cites·8 claims
- 0689US5620782AMethod of fabricating a flex laminate packageIBM·Filed 1995·Granted Apr 15, 1997·59 cites·1 claims
- 0787US9680273B2Electrical connector with electrical contacts protected by a layer of compressible material and method of making itLIGHT DAVID NOEL·Filed 2013·Granted Jun 13, 2017·15 cites·15 claims
- 0886US4479852AMethod for determination of concentration of organic additive in plating bathIBM·Filed 1983·Granted Oct 30, 1984·51 cites·22 claims
- 0985US5829124AMethod for forming metallized patterns on the top surface of a printed circuit boardIBM·Filed 1995·Granted Nov 3, 1998·52 cites·55 claims
- 1085US4725339AMethod for monitoring metal ion concentrations in plating bathsIBM·Filed 1984·Granted Feb 16, 1988·50 cites·5 claims
- 1181US5736679ADeformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit boardIBM·Filed 1995·Granted Apr 7, 1998·49 cites·14 claims
- 1279US4457986AUse of underpotential deposited layers of metals on foreign metal substrates as catalysts for electrolytic cellsIBM·Filed 1982·Granted Jul 3, 1984·24 cites·20 claims
- 1378US10776600B2Electronic sensor supported on rigid substrateIDEX ASA·Filed 2018·Granted Sep 15, 2020·2 cites·20 claims
- 1476US10331934B2Electronic sensor supported on rigid substrateIDEX ASA·Filed 2016·Granted Jun 25, 2019·2 cites·25 claims
- 1574US6066808AMultilayer circuit board having metallized patterns formed flush with a top surface thereofIBM·Filed 1998·Granted May 23, 2000·29 cites·5 claims
- 1674US4490219AMethod of manufacture employing electrochemically dispersed platinum catalysts deposited on a substrateIBM·Filed 1982·Granted Dec 25, 1984·26 cites·8 claims
- 1769US10713461B2Double sided sensor module suitable for integration into electronic devicesIDEX ASA·Filed 2018·Granted Jul 14, 2020·1 cites·29 claims
- 1868US10687424B2Configurable, encapsulated sensor module and method for making sameIDEX ASA·Filed 2018·Granted Jun 16, 2020·2 cites·31 claims
- 1968US5509196AMethod of fabricating a flex laminate packageIBM·Filed 1994·Granted Apr 23, 1996·24 cites·3 claims
- 2067US11895777B2Flexible inlay and manufacturing method thereofIDEX BIOMETRICS ASA·Filed 2021·Granted Feb 6, 2024·0 cites·35 claims
- 2157US10675791B2Method of manufacturing a cover member suitable for a fingerprint sensorIDEX ASA·Filed 2017·Granted Jun 9, 2020·0 cites·14 claims
- 2257US4540473ACopper plating bath having increased plating rate, and methodIBM·Filed 1983·Granted Sep 10, 1985·10 cites·16 claims
- 2356US2014154893A1Electrical connector and method of making itNEOCONIX INC·Filed 2014·Application pending·0 cites
- 2452US10387707B2Reinforcement panel for fingerprint sensor coverIDEX ASA·Filed 2017·Granted Aug 20, 2019·0 cites·21 claims
- 2552US5035778ARegeneration of spent ferric chloride etchantsIBM·Filed 1989·Granted Jul 30, 1991·9 cites·13 claims
- 2650US6734368B1Metal backed printed circuit board assembliesIBM·Filed 1997·Granted May 11, 2004·13 cites·24 claims
- 2748US5920037AConductive bonding design for metal backed circuitsIBM·Filed 1997·Granted Jul 6, 1999·10 cites·5 claims
- 2842US2018068159A1Method of securing a fingerprint sensor onto a cover member incorporated within a host device panelIDEX ASA·Filed 2017·Application pending·0 cites
- 2933US4910049AConditioning a dielectric substrate for plating thereonIBM·Filed 1986·Granted Mar 20, 1990·4 cites·11 claims
- 3032US6178630B1Conductive bonding design and method for aluminum backed circuitsIBM·Filed 1999·Granted Jan 30, 2001·2 cites·30 claims
- 3130US2018358770A1Electrical Connector with Electrical Contacts Protected by a Layer of Compressible Material and Method of Making ItLIGHT DAVID NOEL·Filed 2017·Application pending·0 cites
- 3228US5221420AEtching method for increased circuitized line width and uniformityIBM·Filed 1992·Granted Jun 22, 1993·4 cites·3 claims
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