Inventor · disambiguated record

Kuo-Liang Mao

Also filed as: MAO KUO-LIANG

2 granted patents·55 citations·filing 2000–2000

65Inventor score

Technology areasH05K

Files withSILICONWARE PRECISION INDUSTRIES CO LTD2

Top patents by PatentIndex Score

2 records

0183US6404064B1Flip-chip bonding structure on substrate for flip-chip package applicationSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Jun 11, 2002·38 cites·12 claims
0271US6348740B1Bump structure with dopantsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Feb 19, 2002·17 cites·8 claims

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