Inventor · disambiguated record
Toshihide Uematsu
Also filed as: UEMATSU TOSHIHIDE
8 granted patents·1 pending application·84 citations·filing 1987–2014
85Inventor score
Top patents by PatentIndex Score
9 records- 0183US8883566B2Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structureROHM CO LTD·Filed 2014·Granted Nov 11, 2014·5 cites·5 claims
- 0274US7759224B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2008·Granted Jul 20, 2010·4 cites·5 claims
- 0374US4890780AManufacturing apparatusHITACHI LTD·Filed 1987·Granted Jan 2, 1990·40 cites·6 claims
- 0472US8729698B2Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structureMORIFUJI TADAHIRO·Filed 2010·Granted May 20, 2014·3 cites·6 claims
- 0566US8546244B2Method of manufacturing semiconductor deviceABE YOSHIYUKI·Filed 2012·Granted Oct 1, 2013·2 cites·18 claims
- 0663US5015425AManufacturing apparatusHITACHI LTD·Filed 1989·Granted May 14, 1991·26 cites·6 claims
- 0755US7452787B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Nov 18, 2008·4 cites·35 claims
- 0840US2005260829A1Manufacturing method of a semiconductor deviceUEMATSU TOSHIHIDE·Filed 2005·Application pending·0 cites
- 0936US8378459B2Semiconductor device, semiconductor wafer and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 19, 2013·0 cites·8 claims
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