Inventor · disambiguated record
Jin-Dah Chen
Also filed as: CHEN JIN-DAH · CHEN Jin
9 granted patents·1 pending application·4 citations·filing 2016–2024
79Inventor score
Top patents by PatentIndex Score
10 records- 0177US10644134B2Gate formation with varying work function layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 5, 2020·2 cites·20 claims
- 0274US10115796B2Method of pulling-back sidewall metal layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 30, 2018·2 cites·20 claims
- 0372US11387105B2Loading effect reduction through multiple coat-etch processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·20 claims
- 0470US11830936B2Gate formation with varying work function layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 0565US11239345B2Gate formation with varying work function layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 0664US10755936B2Loading effect reduction through multiple coat-etch processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·0 cites·20 claims
- 0759US10276392B2Loading effect reduction through multiple coat-etch processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
- 0857US2025031461A1Surface modification method for reducing wafer defectsSHANGHAI HUALI INTEGRATED CIRCUIT CORP·Filed 2024·Application pending·0 cites
- 0956US9711604B1Loading effect reduction through multiple coat-etch processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 18, 2017·0 cites·15 claims
- 1049US11316033B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
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