Inventor · disambiguated record
Michael B. Cohn
Also filed as: COHN MICHAEL · COHN MICHAEL B · COHN MICHAEL BENNETT
11 granted patents·6 pending applications·2,245 citations·filing 1992–2020
93Inventor score
Files withMICROASSEMBLY TECHNOLOGIES INC5COHN MICHAEL BENNETT2COHN MICHAEL B1ENDOROBOTICS CORP1PSYApps LLC1
Top patents by PatentIndex Score
17 records- 0196US6872902B2MEMS device with integral packagingMICROASSEMBLY TECHNOLOGIES INC·Filed 2003·Granted Mar 29, 2005·120 cites·46 claims
- 0296US6142358AWafer-to-wafer transfer of microstructures using break-away tethersUNIV CALIFORNIA·Filed 1997·Granted Nov 7, 2000·274 cites·5 claims
- 0395US6853067B1Microelectromechanical systems using thermocompression bondingMICROASSEMBLY TECHNOLOGIES INC·Filed 2003·Granted Feb 8, 2005·102 cites·41 claims
- 0494US7750462B1Microelectromechanical systems using thermocompression bondingMICROASSEMBLY TECHNOLOGIES INC·Filed 2007·Granted Jul 6, 2010·29 cites·21 claims
- 0594US7692521B1High force MEMS deviceMICROASSEMBLY TECHNOLOGIES INC·Filed 2006·Granted Apr 6, 2010·38 cites·76 claims
- 0694US5791231ASurgical robotic system and hydraulic actuator thereforENDOROBOTICS CORP·Filed 1993·Granted Aug 11, 1998·1.4k cites·14 claims
- 0793US5355577AMethod and apparatus for the assembly of microfabricated devicesCOHN MICHAEL B·Filed 1992·Granted Oct 18, 1994·243 cites·6 claims
- 0890US7276789B1Microelectromechanical systems using thermocompression bondingMICROASSEMBLY TECHNOLOGIES INC·Filed 2004·Granted Oct 2, 2007·47 cites·29 claims
- 0971US8295027B2MEMS device with integral packagingCOHN MICHAEL BENNETT·Filed 2012·Granted Oct 23, 2012·1 cites·3 claims
- 1067US12125398B1Integrating health and fitness data with psycholinguistic and contextual data for pattern recognitionPSYApps LLC·Filed 2020·Granted Oct 22, 2024·1 cites·9 claims
- 1161US8179215B2MEMS device with integral packagingCOHN MICHAEL BENNETT·Filed 2007·Granted May 15, 2012·2 cites·4 claims
- 1251US2005168306A1MEMS device with integral packagingFiled 2005·Application pending·0 cites
- 1339US2022223940A1Porous Endothermic ArticleTHERMAL CERAM INC·Filed 2019·Application pending·0 cites
- 1438US2002096421A1MEMS device with integral packagingFiled 2001·Application pending·0 cites
- 1535US2002146919A1Micromachined springs for strain relieved electrical connections to IC chipsFiled 2001·Application pending·0 cites
- 1635US2002179921A1Compliant hermetic packageFiled 2002·Application pending·0 cites
- 1732US2002144548A1High precision accelerometerFiled 2002·Application pending·0 cites
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