Inventor · disambiguated record
Tsuyoshi Amakawa
Also filed as: AMAKAWA TSUYOSHI
3 granted patents·1 pending application·5 citations·filing 1999–2015
58Inventor score
Files withTOWA CORP4
Top patents by PatentIndex Score
4 records- 0162US9728426B2Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like memberTOWA CORP·Filed 2014·Granted Aug 8, 2017·2 cites·3 claims
- 0257US9580827B2Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like memberTOWA CORP·Filed 2015·Granted Feb 28, 2017·1 cites·45 claims
- 0337US2009242524A1Singulation apparatus for manufacturing electronic componentTOWA CORP·Filed 2007·Application pending·0 cites
- 0426US6594889B1Method for processing leadframeTOWA CORP·Filed 1999·Granted Jul 22, 2003·2 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →