Inventor · disambiguated record
Daniel Bolowski
Also filed as: BOLOWSKI DANIEL
3 granted patents·2 citations·filing 2012–2020
50Inventor score
Files withINFINEON TECHNOLOGIES AG3
Top patents by PatentIndex Score
3 records- 0160US8981553B2Power semiconductor module with integrated thick-film printed circuit boardINFINEON TECHNOLOGIES AG·Filed 2012·Granted Mar 17, 2015·2 cites·21 claims
- 0251US11410950B2Semiconductor substrate having a bond pad material based on aluminumINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 9, 2022·0 cites·18 claims
- 0326US9925588B2Semiconductor module bonding wire connection methodINFINEON TECHNOLOGIES AG·Filed 2015·Granted Mar 27, 2018·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →