Inventor · disambiguated record
Nae Yoneda
Also filed as: YONEDA NAE
13 granted patents·1,086 citations·filing 1991–2003
94Inventor score
Top patents by PatentIndex Score
13 records- 0199US5608265AEncapsulated semiconductor device package having holes for electrically conductive materialHITACHI LTD·Filed 1994·Granted Mar 4, 1997·567 cites·54 claims
- 0293US5569960AElectronic component, electronic component assembly and electronic component unitHITACHI LTD·Filed 1995·Granted Oct 29, 1996·105 cites·38 claims
- 0385US5914531ASemiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1997·Granted Jun 22, 1999·68 cites·21 claims
- 0485US5347429APlastic-molded-type semiconductor deviceHITACHI LTD·Filed 1993·Granted Sep 13, 1994·86 cites·10 claims
- 0580US5539250APlastic-molded-type semiconductor deviceHITACHI LTD·Filed 1991·Granted Jul 23, 1996·63 cites·22 claims
- 0678US5357139APlastic encapsulated semiconductor device and lead frameHITACHI LTD·Filed 1993·Granted Oct 18, 1994·58 cites·10 claims
- 0775US6114192AMethod of manufacturing a semiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1998·Granted Sep 5, 2000·39 cites·38 claims
- 0864US5296737ASemiconductor device with a plurality of face to face chipsHITACHI LTD·Filed 1991·Granted Mar 22, 1994·34 cites·20 claims
- 0962US6686226B1Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frameRENESAS TECH CORP·Filed 2000·Granted Feb 3, 2004·9 cites·22 claims
- 1055US5194935APlastic encapsulated semiconductor device and structure for mounting the same devices having particular radiating fin structureHITACHI LTD·Filed 1991·Granted Mar 16, 1993·23 cites·29 claims
- 1154US5295045APlastic-molded-type semiconductor device and producing method thereforHITACHI LTD·Filed 1991·Granted Mar 15, 1994·23 cites·48 claims
- 1253US6861294B2Semiconductor devices and methods of making the devicesRENESAS TECH CORP·Filed 2003·Granted Mar 1, 2005·4 cites·9 claims
- 1335US5256903APlastic encapsulated semiconductor deviceHITACHI LTD·Filed 1991·Granted Oct 26, 1993·7 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →