Inventor · disambiguated record
Asao Nishimura
Also filed as: NISHIMURA ASAO
144 granted patents·6 pending applications·4,558 citations·filing 1986–2013
99Inventor score
Files withHITACHI LTD107RENESAS TECH CORP31RENESAS ELECTRONICS CORP3AKITA ELECTRONICS SYSTEMS CO L1NISHIMURA ASAO1
Top patents by PatentIndex Score
150 records- 0199US5608265AEncapsulated semiconductor device package having holes for electrically conductive materialHITACHI LTD·Filed 1994·Granted Mar 4, 1997·567 cites·54 claims
- 0298US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0397US7138722B2Semiconductor deviceRENESAS TECH CORP·Filed 2005·Granted Nov 21, 2006·46 cites·7 claims
- 0496US6798072B2Flip chip assembly structure for semiconductor device and method of assembling thereforHITACHI LTD·Filed 2001·Granted Sep 28, 2004·144 cites·12 claims
- 0595US7420284B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Sep 2, 2008·39 cites·9 claims
- 0694US6521981B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Feb 18, 2003·37 cites·18 claims
- 0794US6342728B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Jan 29, 2002·38 cites·12 claims
- 0894US6335565B1Semiconductor deviceHITACHI LTD·Filed 1996·Granted Jan 1, 2002·164 cites·9 claims
- 0992US6861742B2Wafer level chip size package having rerouting layersRENESAS TECH CORP·Filed 2002·Granted Mar 1, 2005·64 cites·19 claims
- 1092US6670215B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted Dec 30, 2003·28 cites·4 claims
- 1192US6472727B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Oct 29, 2002·31 cites·20 claims
- 1292US6413850B1Method of forming bumpsHITACHI LTD·Filed 2000·Granted Jul 2, 2002·102 cites·12 claims
- 1391US7091620B2Semiconductor device and manufacturing method thereofAKITA ELECTRONICS SYSTEMS CO L·Filed 2005·Granted Aug 15, 2006·21 cites·20 claims
- 1491US6627997B1Semiconductor module and method of mountingHITACHI LTD·Filed 1999·Granted Sep 30, 2003·124 cites·8 claims
- 1591US6621154B1Semiconductor apparatus having stress cushioning layerHITACHI LTD·Filed 2000·Granted Sep 16, 2003·65 cites·29 claims
- 1691US6342726B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 1999·Granted Jan 29, 2002·42 cites·9 claims
- 1791US5571428ASemiconductor leadframe and its production method and plastic encapsulated semiconductor deviceHITACHI LTD·Filed 1995·Granted Nov 5, 1996·113 cites·3 claims
- 1889US7910922B2Semiconductor integrated circuit device and manufacture thereofRENESAS ELECTRONICS CORP·Filed 2010·Granted Mar 22, 2011·8 cites·14 claims
- 1989US6784554B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Aug 31, 2004·49 cites·10 claims
- 2089US6211576B1Semiconductor deviceHITACHI LTD·Filed 1999·Granted Apr 3, 2001·62 cites·17 claims
- 2188US7550763B2Semiconductor integrated circuit device and manufacture thereofRENESAS TECH CORP·Filed 2007·Granted Jun 23, 2009·11 cites·4 claims
- 2288US6831294B1Semiconductor integrated circuit device having bump electrodes for signal or power only, and testing pads that are not coupled to bump electrodesRENESAS TECH CORP·Filed 1999·Granted Dec 14, 2004·70 cites·15 claims
- 2387US6784541B2Semiconductor module and mounting method for sameHITACHI LTD·Filed 2002·Granted Aug 31, 2004·37 cites·10 claims
- 2486US6770547B1Method for producing a semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 3, 2004·40 cites·28 claims
- 2586US6710446B2Semiconductor device comprising stress relaxation layers and method for manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Mar 23, 2004·44 cites·10 claims
- 2686US6642083B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Nov 4, 2003·17 cites·10 claims
- 2786US6624504B1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 23, 2003·43 cites·24 claims
- 2886US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 2985US6927489B1Semiconductor device provided with rewiring layerRENESAS TECH CORP·Filed 2000·Granted Aug 9, 2005·40 cites·12 claims
- 3085US6492719B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Dec 10, 2002·27 cites·14 claims
- 3185US6365439B2Method of manufacturing a ball grid array type semiconductor packageHITACHI LTD·Filed 2001·Granted Apr 2, 2002·17 cites·19 claims
- 3285US5347429APlastic-molded-type semiconductor deviceHITACHI LTD·Filed 1993·Granted Sep 13, 1994·86 cites·10 claims
- 3385US5041901ALead frame and semiconductor device using the sameHITACHI LTD·Filed 1990·Granted Aug 20, 1991·82 cites·20 claims
- 3485US4942452ALead frame and semiconductor deviceHITACHI LTD·Filed 1988·Granted Jul 17, 1990·72 cites·23 claims
- 3584US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 3684US5299092APlastic sealed type semiconductor apparatusHITACHI LTD·Filed 1992·Granted Mar 29, 1994·80 cites·15 claims
- 3784US5159434ASemiconductor device having a particular chip pad structureHITACHI LTD·Filed 1991·Granted Oct 27, 1992·68 cites·27 claims
- 3883US6930388B2Semiconductor device and method for manufacturing the same and semiconductor device-mounted structureRENESAS TECH CORP·Filed 2001·Granted Aug 16, 2005·37 cites·24 claims
- 3983US6822317B1Semiconductor apparatus including insulating layer having a protrusive portionRENESAS TECH CORP·Filed 2000·Granted Nov 23, 2004·37 cites·16 claims
- 4083US6355500B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·14 cites·15 claims
- 4182US7119446B2Semiconductor deviceHITACHI LTD·Filed 2006·Granted Oct 10, 2006·6 cites·9 claims
- 4282US6696765B2Multi-chip moduleHITACHI LTD·Filed 2001·Granted Feb 24, 2004·23 cites·7 claims
- 4381US7057283B2Semiconductor device and method for producing the sameHITACHI LTD·Filed 2004·Granted Jun 6, 2006·26 cites·30 claims
- 4481US5488254APlastic-molded-type semiconductor deviceHITACHI LTD·Filed 1994·Granted Jan 30, 1996·66 cites·21 claims
- 4580US8629481B2Semiconductor integrated circuit deviceNISHIMURA ASAO·Filed 2011·Granted Jan 14, 2014·5 cites·8 claims
- 4680US7247879B2Semiconductor integrated circuit device having particular testing pad arrangementRENESAS TECH CORP·Filed 2004·Granted Jul 24, 2007·20 cites·17 claims
- 4780US6940162B2Semiconductor module and mounting method for sameRENESAS TECH CORP·Filed 2004·Granted Sep 6, 2005·23 cites·24 claims
- 4880US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 4980US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 5080US5539250APlastic-molded-type semiconductor deviceHITACHI LTD·Filed 1991·Granted Jul 23, 1996·63 cites·22 claims
Showing the top 50 of 150 patent records by PatentIndex Score.
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