Inventor · disambiguated record
Tetsuro Yamada
Also filed as: YAMADA TETSURO
52 granted patents·12 pending applications·203 citations·filing 1988–2022
97Inventor score
Top patents by PatentIndex Score
64 records- 0191US12240868B2Organic silicon compound and production method thereforSHINETSU CHEMICAL CO·Filed 2019·Granted Mar 4, 2025·2 cites·7 claims
- 0287US9303180B2Low-temperature cureable coating composition and article having cured coating thereofSHINETSU CHEMICAL CO·Filed 2014·Granted Apr 5, 2016·5 cites·11 claims
- 0384US10479880B2Rubber composition for tires and pneumatic tireSUMITOMO RUBBER IND·Filed 2017·Granted Nov 19, 2019·1 cites·3 claims
- 0484US9188743B2Optical coupling structure and optical transmission apparatusFUJITSU LTD·Filed 2013·Granted Nov 17, 2015·7 cites·8 claims
- 0583US9992878B2Circuit board and method of manufacturing the sameFUJITSU LTD·Filed 2015·Granted Jun 5, 2018·4 cites·9 claims
- 0678US10877216B2Optical waveguide substrate, method of manufacturing optical waveguide substrate, and method of repairing optical waveguide substrateFUJITSU LTD·Filed 2019·Granted Dec 29, 2020·2 cites·7 claims
- 0778US5945463AComposition for a gasket and process for producing a gasket using the compositionZEON RIZE CO LTD·Filed 1995·Granted Aug 31, 1999·36 cites·14 claims
- 0877US9360639B2Electronic device and optical connectorFUJITSU LTD·Filed 2014·Granted Jun 7, 2016·4 cites·12 claims
- 0975US9683131B2Low-temperature, fast curing coating composition and cured articleSHINETSU CHEMICAL CO·Filed 2014·Granted Jun 20, 2017·1 cites·17 claims
- 1074US10353158B2Light emitting element bonded board and method of manufacturing light emitting element bonded boardFUJITSU LTD·Filed 2017·Granted Jul 16, 2019·2 cites·5 claims
- 1174US9475969B2Organopolysiloxane compound having ethynyl groups, method for preparing linear organopolysiloxane compound having ethynyl groups at both terminals of molecular chain, method for preparing organopolysiloxane polymer having alkoxysilyl-ethylene group at terminal, room temperature curable composition and molded product which is cured product thereofSHINETSU CHEMICAL CO·Filed 2013·Granted Oct 25, 2016·1 cites·13 claims
- 1274US9148958B2Circuit board and electronic deviceFUJITSU LTD·Filed 2014·Granted Sep 29, 2015·2 cites·2 claims
- 1374US8648260B2Wiring substrateOOI TAKAHIRO·Filed 2011·Granted Feb 11, 2014·4 cites·4 claims
- 1471US5667401ACable connector, circuit board and system having circuit boards connected together by the cable connectorFUJITSU LTD·Filed 1995·Granted Sep 16, 1997·28 cites·19 claims
- 1569US12091512B2Organopolysiloxane and coating composition containing organopolysiloxaneSHINETSU CHEMICAL CO·Filed 2022·Granted Sep 17, 2024·0 cites·1 claims
- 1668US10212805B2Printed circuit board and electric deviceFUJITSU LTD·Filed 2017·Granted Feb 19, 2019·1 cites·9 claims
- 1767US11691994B2Aqueous solution composition containing organosilicon compoundsSHINETSU CHEMICAL CO·Filed 2022·Granted Jul 4, 2023·0 cites·4 claims
- 1867US9715062B2Optical axis adjustment method for optical interconnection, and optical interconnection substrateFUJITSU LTD·Filed 2015·Granted Jul 25, 2017·1 cites·10 claims
- 1967US8958211B2Circuit board and electronic deviceHIROSHIMA YOSHIYUKI·Filed 2011·Granted Feb 17, 2015·2 cites·9 claims
- 2066US11158964B2Electronic component and substrateFUJITSU LTD·Filed 2020·Granted Oct 26, 2021·0 cites·7 claims
- 2165US9763331B2Printed circuit board, electronic device, and manufacturing methodFUJITSU LTD·Filed 2016·Granted Sep 12, 2017·1 cites·9 claims
- 2264US12173155B2Silicone emulsion compositionSHINETSU CHEMICAL CO·Filed 2019·Granted Dec 24, 2024·0 cites·4 claims
- 2362US10714849B2Electronic component and substrateFUJITSU LTD·Filed 2019·Granted Jul 14, 2020·1 cites·10 claims
- 2462US5000130AIntake system for multi cylinder engineYAMAHA MOTOR CO LTD·Filed 1990·Granted Mar 19, 1991·19 cites·15 claims
- 2562US2023140993A1Organopolysiloxane and curable composition containing sameSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 2659US10975106B2Organic silicon compound, method for producing the same, and curable compositionSHINETSU CHEMICAL CO·Filed 2020·Granted Apr 13, 2021·0 cites·12 claims
- 2759US5092284AControl valve arrangement for engineYAMAHA MOTOR CO LTD·Filed 1990·Granted Mar 3, 1992·24 cites·18 claims
- 2858US11932782B2Room temperature curable resin composition, coating agent, adhesive, sealing agent, and articleSHINETSU CHEMICAL CO·Filed 2020·Granted Mar 19, 2024·0 cites·8 claims
- 2958US9049794B2Wiring substrate and method for manufacturing the wiring substrateMORITA YOSHIHIRO·Filed 2011·Granted Jun 2, 2015·1 cites·6 claims
- 3057US11292881B2Polyoxyalkylene group-containing organosilicon compound and method for producing sameSHINETSU CHEMICAL CO·Filed 2017·Granted Apr 5, 2022·0 cites·16 claims
- 3156US12054588B2Organopolysiloxane compound, method for producing same, and antistatic agent and curable composition, each of which contains sameSHINETSU CHEMICAL CO·Filed 2019·Granted Aug 6, 2024·0 cites·12 claims
- 3256US11970580B2Room-temperature-curable organopolysiloxane composition for oil seal, and automotive partSHINETSU CHEMICAL CO·Filed 2020·Granted Apr 30, 2024·0 cites·5 claims
- 3356US10151878B2Optical interconnection substrate including optical transmitter with light source and mark or optical receiver with light receiving unit and markFUJITSU LTD·Filed 2017·Granted Dec 11, 2018·0 cites·9 claims
- 3456US9572293B2Placement apparatus and a suction nozzle for an optical componentFUJITSU LTD·Filed 2014·Granted Feb 14, 2017·0 cites·14 claims
- 3556US2021218226A1Laser wavelength control device and method for controlling laser wavelengthFUJITSU LTD·Filed 2020·Application pending·0 cites
- 3655US8354600B2Printed wiring board and electronic deviceFUJITSU LTD·Filed 2009·Granted Jan 15, 2013·0 cites·11 claims
- 3753US11078385B2Removable radiation-curable silicone composition and release sheetSHINETSU CHEMICAL CO·Filed 2018·Granted Aug 3, 2021·0 cites·3 claims
- 3853US2022396670A1Organopolysiloxane and coating composition containing sameSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 3952US9470856B2Method of manufacturing photoelectric composite substrateFUJITSU LTD·Filed 2013·Granted Oct 18, 2016·0 cites·5 claims
- 4051US11667790B2Polymer having reactive silicon-containing group and production method thereforSHINETSU CHEMICAL CO·Filed 2019·Granted Jun 6, 2023·0 cites·5 claims
- 4151US10941317B2Room-temperature-curable organopolysiloxane composition and base materialSHINETSU CHEMICAL CO·Filed 2018·Granted Mar 9, 2021·0 cites·8 claims
- 4251US10492291B2Wiring board manufacturing methodFUJITSU LTD·Filed 2017·Granted Nov 26, 2019·0 cites·10 claims
- 4351US5038575ARefrigerator with defrost override systemTOSHIBA KK·Filed 1990·Granted Aug 13, 1991·20 cites·8 claims
- 4450US8777091B2Light emitting member mounting method and apparatusFUJITSU LTD·Filed 2013·Granted Jul 15, 2014·0 cites·3 claims
- 4550US8631568B2Printed wiring board manufacturing methodYAMADA TETSURO·Filed 2011·Granted Jan 21, 2014·1 cites·8 claims
- 4649US10323048B2Organosilicon compound and production process thereforSHINETSU CHEMICAL CO·Filed 2017·Granted Jun 18, 2019·0 cites·7 claims
- 4749US10164312B2Wiring board, electronic apparatus, and manufacturing method of wiring boardFUJITSU LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 4849US5099812ACylinder head for internal combustion engineYAMAHA MOTOR CO LTD·Filed 1990·Granted Mar 31, 1992·13 cites·12 claims
- 4948US11435385B2Specific conductivity measurement method, recording medium recording specific conductivity calculation program, and specific conductivity measurement systemFUJITSU LTD·Filed 2020·Granted Sep 6, 2022·0 cites·5 claims
- 5047US2020150365A1Optical moduleFUJITSU LTD·Filed 2019·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
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