Inventor · disambiguated record
Jungihl Kim
Also filed as: KIM JUNGIHL
13 granted patents·899 citations·filing 1986–1995
94Inventor score
Files withIBM13
Top patents by PatentIndex Score
13 records- 0195US4975079AConnector assembly for chip testingIBM·Filed 1990·Granted Dec 4, 1990·240 cites·10 claims
- 0294US5185073AMethod of fabricating nendritic materialsIBM·Filed 1991·Granted Feb 9, 1993·173 cites·4 claims
- 0391US5582858AAdhesive layer in multi-level packaging and organic material as a metal diffusion barrierIBM·Filed 1995·Granted Dec 10, 1996·113 cites·14 claims
- 0491US5137461ASeparable electrical connection technologyIBM·Filed 1990·Granted Aug 11, 1992·134 cites·8 claims
- 0587US5326643AAdhesive layer in multi-level packaging and organic material as a metal diffusion barrierIBM·Filed 1991·Granted Jul 5, 1994·41 cites·31 claims
- 0686US5283104AVia paste compositions and use thereof to form conductive vias in circuitized ceramic substratesIBM·Filed 1991·Granted Feb 1, 1994·80 cites·31 claims
- 0774US5599582AAdhesive layer in multi-level packaging and organic material as a metal diffusion barrierIBM·Filed 1995·Granted Feb 4, 1997·25 cites·10 claims
- 0869US5337475AProcess for producing ceramic circuit structures having conductive viasIBM·Filed 1992·Granted Aug 16, 1994·37 cites·16 claims
- 0963US4781970AStrengthening a ceramic by post sinter coating with a compressive surface layerIBM·Filed 1987·Granted Nov 1, 1988·28 cites·47 claims
- 1044US4896464AFormation of metallic interconnects by grit blastingIBM·Filed 1988·Granted Jan 30, 1990·12 cites·18 claims
- 1138US5053272AOptical storage deviceIBM·Filed 1989·Granted Oct 1, 1991·3 cites·19 claims
- 1237US4751349AZirconium as an adhesion material in a multi-layer metallic structureIBM·Filed 1986·Granted Jun 14, 1988·8 cites·3 claims
- 1333US5170245ASemiconductor device having metallic interconnects formed by grit blastingIBM·Filed 1991·Granted Dec 8, 1992·5 cites·13 claims
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