Inventor · disambiguated record
Masami Sakuraba
Also filed as: SAKURABA MASAMI
15 granted patents·1 pending application·321 citations·filing 1988–2014
94Inventor score
Files withDOWA MINING CO10DAI ICHI KOGYO SEIYAKU CO LTD2DIA ICHI KOGYO SEIYAKU CO LTD1KYOTO ELEX CO LTD1NAKAYAMA MASASHI1
Top patents by PatentIndex Score
16 records- 0183US5965193AProcess for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic materialDOWA MINING CO·Filed 1997·Granted Oct 12, 1999·68 cites·22 claims
- 0277US6354484B1Process for producing a metal-ceramic composite substrateDOWA MINING CO·Filed 2000·Granted Mar 12, 2002·13 cites·2 claims
- 0376US6054762ASemiconductor substrates of high reliability ceramic metal compositesDOWA MINING CO·Filed 1997·Granted Apr 25, 2000·32 cites·13 claims
- 0475US8852465B2Electro-conductive paste for forming an electrode of a solar cell device, a solar cell device and method for producing the solar cell deviceNAKAYAMA MASASHI·Filed 2009·Granted Oct 7, 2014·4 cites·16 claims
- 0573US6399019B1Brazing material for use in joining a metal plate to a ceramic substrateDOWA MINING CO·Filed 2000·Granted Jun 4, 2002·7 cites·4 claims
- 0671US5035837ACopper paste compositionDIA ICHI KOGYO SEIYAKU CO LTD·Filed 1990·Granted Jul 30, 1991·37 cites·16 claims
- 0769US6221511B1Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such methodDOWA MINING CO·Filed 1998·Granted Apr 24, 2001·28 cites·3 claims
- 0868US9461188B2Electro-conductive paste for forming an electrode of a solar cell device, a solar cell device and method for producing the solar cell deviceKYOTO ELEX CO LTD·Filed 2014·Granted Oct 4, 2016·0 cites·4 claims
- 0964US4937016ACopper conductor compositionDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1989·Granted Jun 26, 1990·25 cites·3 claims
- 1061US4865772ACopper thick film conductor compositionSUEHIRO MASATOSHI·Filed 1988·Granted Sep 12, 1989·23 cites·8 claims
- 1159US6183875B1Electronic circuit substrates fabricated from an aluminum ceramic composite materialDOWA MINING CO·Filed 1998·Granted Feb 6, 2001·21 cites·20 claims
- 1259US5955686ABrazing materials for producing metal-ceramics composite substratesDOWA MINING CO·Filed 1997·Granted Sep 21, 1999·19 cites·15 claims
- 1354US4906404ACopper conductor compositionDAI ICHI KOGYO SEIYAKU CO LTD·Filed 1988·Granted Mar 6, 1990·20 cites·1 claims
- 1446US6071592AMetal-ceramic composite substrateDOWA MINING CO·Filed 1997·Granted Jun 6, 2000·13 cites·2 claims
- 1543US6013357APower module circuit board and a process for the manufacture thereofDOWA MINING CO·Filed 1997·Granted Jan 11, 2000·11 cites·12 claims
- 1637US2004069528A1Process for producing ceramic circuit boardsDOWA MINING CO·Filed 2002·Application pending·0 cites
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