Inventor · disambiguated record
Shyh-Ing Wu
Also filed as: WU SHYH-ING
9 granted patents·3 pending applications·86 citations·filing 1998–2006
87Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG11
Top patents by PatentIndex Score
12 records- 0177US7651937B2Bumping process and structure thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jan 26, 2010·9 cites·8 claims
- 0273US6918178B2Method of attaching a heat sink to an IC packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 19, 2005·26 cites·11 claims
- 0372US7518241B2Wafer structure with a multi-layer barrier in an UBM layer network device with power supplyADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Apr 14, 2009·7 cites·14 claims
- 0472US6692581B2Solder paste for fabricating bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·18 cites·12 claims
- 0552US6355499B1Method of making ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Mar 12, 2002·8 cites·11 claims
- 0648US5982625ASemiconductor packaging deviceADVANCED SEMICONDUCTOR ENG·Filed 1998·Granted Nov 9, 1999·15 cites·20 claims
- 0743US6429049B1Laser method for forming viasADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Aug 6, 2002·3 cites·17 claims
- 0840US2007108612A1Chip structure and manufacturing method of the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 0939US2006097392A1Wafer structure, chip structure and bumping processADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 1035US2004124171A1[bump-forming process]Filed 2003·Application pending·0 cites
- 1132US7727878B2Method for forming passivation layerADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 1, 2010·0 cites·16 claims
- 1229US6252309B1Packaged semiconductor substrateADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jun 26, 2001·0 cites·3 claims
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