Inventor · disambiguated record
Tetsuro Iwakura
Also filed as: IWAKURA TETSURO
3 granted patents·1 pending application·8 citations·filing 2005–2021
56Inventor score
Top patents by PatentIndex Score
4 records- 0178US8017444B2Adhesive sheet, semiconductor device, and process for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2005·Granted Sep 13, 2011·8 cites·15 claims
- 0257US12466946B2Method for producing FRP precursorRESONAC CORP·Filed 2021·Granted Nov 11, 2025·0 cites·19 claims
- 0345US11905412B2Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor packageSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Feb 20, 2024·0 cites·16 claims
- 0443US2011287250A1Adhesive sheet, semiconductor device, and process for producing semiconductor deviceINADA TEIICHI·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →