Inventor · disambiguated record
Manfred Wossler
Also filed as: WOSSLER MANFRED
6 granted patents·1 pending application·130 citations·filing 1977–2003
84Inventor score
Top patents by PatentIndex Score
7 records- 0189US6504104B2Flexible wiring for the transformation of a substrate with edge contacts into a ball grid arraySIEMENS AG·Filed 2001·Granted Jan 7, 2003·67 cites·9 claims
- 0273US6555758B1Multiple blank for electronic components such as SAW components, and method of building up bumps, solder frames, spacers and the likeEPCOS AG·Filed 2000·Granted Apr 29, 2003·20 cites·6 claims
- 0367US6685168B1Surface acoustic wave componentEPCOS AG·Filed 1999·Granted Feb 3, 2004·21 cites·7 claims
- 0452US6969917B2Electronic chip component with an integrated circuit and fabrication methodINFINEON TECHNOLOGIES AG·Filed 2003·Granted Nov 29, 2005·4 cites·54 claims
- 0546US4177983ADevice for picking up, depositing and transporting thin metal foils by means of a vacuum lifting deviceSIEMENS AG·Filed 1977·Granted Dec 11, 1979·7 cites·10 claims
- 0644US2005031490A1Module for an analysis device, applicator as an exchange part of the analysis device and analysis device associated therewithFiled 2002·Application pending·0 cites
- 0743US6256877B1Method for transforming a substrate with edge contacts into a ball grid arraySIEMENS AG·Filed 1998·Granted Jul 10, 2001·11 cites·5 claims
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